Electrolytic Copper Foil Copper-Based Polymer Material Composite Plating Process

Abstract

The invention discloses a composite plating treatment process of an electrolytic copper foil copper-based high polymer material. According to the process, original copper foil posttreatment equipment is adopted, and an auxiliary pulse power supply is additionally arranged. The composite plating treatment process comprises the following steps: (1) carrying out acid cleaning activation by adopting sulfuric acid H2SO4 to remove oxides from the surface of a copper foil; (2) carrying out copper-based composite plating, namely forming a composite plating layer of copper and the high polymer material on the surface of the copper foil and uniformly distributing a polar high polymer organic matter on the surface of the copper foil, wherein the polar end and the crystal structure of the copper plating layer are firmly fused and the non-polar end is exposed out of the surface of the plating layer, and thus a favorable binding force is formed between the copper foil and non-metal materials such as resin in a chemical bond manner; and (3) washing with water to remove a residual solution from the surface of the copper foil so as to prevent copper foil oxidation, and then entering into the subsequent processing procedure. According to the process disclosed by the invention, the roughness of the surface of the copper foil can be adjusted at will according to the development demands of the electronic industry, the copper foil with double smooth surfaces is produced, and the development trends of exquisite lines, high Tg value and high flexibility of a printed circuit board are met.

Description

[0001] Technical field: [0002] The invention relates to a production and processing technology of electrolytic copper foil, in particular to a composite plating treatment technology of copper-based polymer materials of electrolytic copper foil. [0003] Background technique: [0004] In the existing electrolytic copper foil production process, copper ions in the solution are deposited on the surface of metal (titanium or stainless steel) rollers by means of electrodeposition (electroplating), and the copper ions on the surface of the roller are continuously deposited under the continuous rotation of the roller and the surface of the roller is The copper film is peeled off and rolled, and the collected copper foil roll passes through the unwinding device and enters the post-processing machine to roughen the surface of the copper foil and plate other metals (zinc, nickel, cobalt, molybdenum, indium, chromium, etc.) to prevent the surface Oxidation at room temperature and high t...

AI Technical Summary

Problems solved by technology

[0005] The main disadvantage of the existing copper foil process is that the downstream products of copper foil are mainly copper clad laminates, circuit boards and lithium battery electrode materials, all of which require good bonding and bonding capabilities of copper foil and resin and other non-metallic materials. In order to achieve copper foil and Good bonding ability (anti-peel strength) between non-metallic materials. The existing copper foil process requires the formation of a microscopic and complex mountain-like multi-protrusion surface on the rough surface of the copper foil, which puts forward extremely strict process parameters for the production process. The yield rate is greatly restricted. On the other hand, downstream products are developing towards ultra-thin, integrated, and miniaturized. Copper foil must meet the requirements of ultra-thin, low profile, low roughness, and high flexibility. The existing copper foil process is in the It is necessary to find a reasonable process balance point between forming a micro-rough surface and reducing the roughness. The difficulty of production is greatly increased, and it is increasingly unable to meet the development needs of the electronics industry.