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A kind of resin composition and the copper clad board made thereof

A resin composition, epoxy resin technology, applied in layered products, metal layered products, chemical instruments and methods, etc., can solve the problems of high price and high cost, achieve high Tg value, excellent flexural performance, The effect of enhancing toughness

Active Publication Date: 2017-11-03
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

PI film has excellent flexural performance but high cost, which leads to very high price of its derived PCB products

Method used

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  • A kind of resin composition and the copper clad board made thereof
  • A kind of resin composition and the copper clad board made thereof
  • A kind of resin composition and the copper clad board made thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] A resin composition, comprising the following components by weight: 50 parts of phosphorus-containing epoxy resin (Dow Chemical, XZ92530), 10 parts of novolac epoxy resin (HEXION, EPR627), silicone rubber core-shell structure modification 16 parts of epoxy resin (Evonik Hans, ALBIDUR EP2240A), 20 parts of silicone-epoxy block copolymer (Evonik Hans, ALBIFLEX296), 4 parts of dicyandiamide.

[0021] Described resin composition prepares the method for prepreg, comprises the steps:

[0022] Add an imidazole accelerator and a solvent to the composition to form a glue solution, stir and mix evenly, soak 1080 glass fiber cloth in the glue solution, bake in an oven at 155°C for 5 minutes to remove the solvent, and obtain a prepreg.

[0023] Preparing a copper clad laminate with the prepreg comprises the following steps:

[0024] Use a single prepreg, cover the top and bottom with a 18μ electrolytic copper foil, and laminate in a vacuum press. The lamination conditions are 190°...

Embodiment 2

[0027] A resin composition, comprising the following components by weight: 60 parts of phosphorus-containing epoxy resin (Dow Chemical, XZ92530), 7 parts of novolak epoxy resin (HEXION, EPR627), silicone rubber core-shell structure modification 20 parts of epoxy resin (Evonik Hans, ALBIDUR EP2240A), 10 parts of silicone-epoxy block copolymer (Evonik Hans, ALBIFLEX296), 3 parts of dicyandiamide.

[0028] Described resin composition prepares the method for prepreg, comprises the steps:

[0029] Add an imidazole accelerator and a solvent to the composition to form a glue solution, stir and mix evenly, soak 1080 glass fiber cloth in the glue solution, bake in an oven at 155°C for 5 minutes to remove the solvent, and obtain a prepreg.

[0030] Preparing a copper clad laminate with the prepreg comprises the following steps:

[0031] Use a single prepreg, cover the top and bottom with a 18μ electrolytic copper foil, and laminate in a vacuum press. The lamination conditions are 190°C...

Embodiment 3

[0034] A resin composition, comprising the following components by weight: 70 parts of phosphorus-containing epoxy resin (Dow Chemical, XZ92530), 5 parts of novolak epoxy resin (HEXION, EPR627), silicone rubber core-shell structure modification 10 parts of epoxy resin (Evonik Hans, ALBIDUR EP2240A), 13 parts of silicone-epoxy block copolymer (Evonik Hans, ALBIFLEX296), 2 parts of dicyandiamide.

[0035] Described resin composition prepares the method for prepreg, comprises the steps:

[0036] Add an imidazole accelerator and a solvent to the composition to form a glue solution, stir and mix evenly, soak 1080 glass fiber cloth in the glue solution, bake in an oven at 155°C for 5 minutes to remove the solvent, and obtain a prepreg.

[0037] Preparing a copper clad laminate with the prepreg comprises the following steps:

[0038] Use a single prepreg, cover the top and bottom with a 18μ electrolytic copper foil, and laminate in a vacuum press. The lamination conditions are 190°C...

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PUM

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Abstract

The invention provides a resin composition and a copper-clad plate manufactured from the same. The resin composition comprises the following components in parts by weight: 50-70 parts of phosphorus-containing epoxy resin, 5-10 parts of phenolic epoxy resin, 10-20 parts of modified epoxy resin with a silicone rubber core-shell structure, 10-20 parts of an organic silicon-epoxy block copolymer and 2-4 parts of dicyandiamide. The resin composition can not only strengthen the toughness of a system, but also ensure little influence on Tg of the system by introducing the modified epoxy resin with the silicone rubber core-shell structure and the organic silicon-epoxy block copolymer; compared with ordinary FR-4, the copper-clad plate manufactured by using the resin composition has better flexural property and can keep a higher Tg value.

Description

technical field [0001] The present invention relates to the technical field of copper clad laminates, in particular to a resin composition and a copper clad laminate produced therefrom. Background technique [0002] The miniaturization and multi-function of electronic products, especially the miniaturization and high performance of consumer electronic products have become an obvious trend, which requires PCB to achieve high density and high performance. Under this premise, flexible boards and rigid-flexible boards have shown advantages. These special-structure PCB boards can significantly reduce the volume occupied by electronic products and achieve dense assembly and three-dimensional assembly. [0003] At present, the reinforcing material used in the flexible copper clad laminate (FCCL) is PI film, and the reinforcing material used in the flexible part of the rigid-flexible board is also PI film. PI film has excellent flexural performance but high cost, which leads to ver...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L63/04C08L83/10C08J5/24B32B15/092
Inventor 汪青
Owner GUANGDONG SHENGYI SCI TECH
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