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Anisotropic conducting film and manufacturing method for same

An anisotropic, conductive film technology, applied in the direction of cable/conductor manufacturing, conductive adhesive connection, conductive materials dispersed in non-conductive inorganic materials, etc., can solve the poor filling rate of conductive particles in the uniformity of pores, porous Complicated film process and other issues, to achieve good vertical conduction and lateral insulation, improve vertical conduction performance, and increase the effect of filling density

Inactive Publication Date: 2014-05-21
EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the process of forming a porous film is relatively complicated, and the uniformity of the pores and the filling rate of the conductive particles in the pores are not good.

Method used

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  • Anisotropic conducting film and manufacturing method for same

Examples

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Embodiment 1

[0068] Dissolve 50 grams of polyimide in 150 ml of dimethylacetamide to form a solution with a viscosity of 0.5 Pa·s. Using a screen with a strip pattern with a pitch of 2 μm, the above solution is printed and coated on the substrate by a screen printing process, and the printing and coating operation is repeated several times to form a plurality of isolations with a pitch of 2 μm on the substrate. film layer. After heating and curing at 120° C. for 30 minutes, a plurality of completely cured isolation layers with a height of 15 μm were formed on the substrate.

[0069] 60 gram epoxy resins (JE6110-3) are dissolved in the organic solvent of 170ml toluene / ethyl acetate, then add 3ml latent curing agent (2-heptadecyl imidazole modified curing agent), then 120 grams particle size Conductive gold balls with a diameter of 5 μm were dispersed therein to form a mixed solution containing conductive particles and a resin binder.

[0070] The substrate formed with multiple isolation l...

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PUM

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Abstract

The invention provides an anisotropic conducting film and a manufacturing method for the same. The anisotropic conducting film comprises a plurality of strip-shaped insulating isolation layers extending along a film width direction and vertically to the surface of the anisotropic conducting film, and mutually parallel, a plurality of micro-cavities composed of an interval space between every two adjacent insulating isolation layers respectively, and conducting particles and resin adhesives filled in the plurality of micro-cavities, wherein the conducting particles are uniformly dispersed in the resin adhesives. The anisotropic conducting film provided by the invention is good in vertical conductivity and transversal insulativity, and beneficial to further narrow-distance realization. In addition, according to the manufacturing method for the anisotropic conducting film provided by the invention, the plurality of isolation layer structures are formed by a silk-screen printing method, the distances, heights and thicknesses of the isolation layers are easy to control, the process is simple, and the cost is low.

Description

technical field [0001] The invention relates to an anisotropic conductive film and a manufacturing method thereof, in particular to an anisotropic conductive film capable of further narrowing the distance while ensuring lateral insulation and a manufacturing method thereof. Background technique [0002] With the increasing miniaturization and thinning of electronic equipment, the connection between micro circuits and the connection between micro circuits and micro electronic components are widely involved. At present, anisotropic conductive film is often used to bond electronic components and circuit substrates and make them electrically conductive. Anisotropic conductive film is a polymer film that has three functions of conduction, insulation and bonding. Particles and insulating resin adhesive are two parts. Conductive particles provide conductivity. The resin adhesive is cured by heating and pressing to fix the circuit board and electronic components, and has moisture-pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B5/00H01B5/16H01B13/00H01R4/04
CPCH01B1/22H01B3/305H01B3/306H01B3/40H01B13/00H01L23/4828
Inventor 张其国
Owner EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
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