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Vertical conductive adhesive and preparation method thereof

A technology of conductive adhesive and conductive metal powder, which is applied in the field of vertical conductive adhesive, can solve the problems of conduction blind spots and easy deposition of conductive metal powder, etc., achieve good fixation performance, reduce conductive metal deposition, and reduce conduction blind spots.

Inactive Publication Date: 2017-02-01
强新正品(苏州)环保材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the deficiencies in the prior art, provide a vertical conductive adhesive, and solve the technical problems in the prior art that the vertical conductive adhesive has conduction blind spots and conductive metal powder is easy to deposit

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] The composition of the vertical conductive glue in the present embodiment is recorded as:

[0022] Silicone raw rubber: 35 parts; epoxy resin: 15 parts; conductive metal powder adopts 30 parts of gold-plated powder, nickel powder 15 parts; dispersant uses 0.2 parts of coupling agent.

[0023] The preparation method is as follows:

[0024] Step 1: Mix the raw silicone rubber and epoxy resin according to the proportion, put it into the internal mixer, heat at 120°C under vacuum, and stir for 25 minutes;

[0025] Step 2: Put the gold-plated powder, nickel powder and dispersant together into the mixer and stir for 25 minutes;

[0026] Step 3: Put the raw materials with a good ratio into the calender for calendering, and then bake and shape to obtain the finished vertical conductive adhesive.

[0027] According to the experimental test, compared with the vertical conductive adhesive in the prior art, the conductive blind spots of the vertical conductive adhesive thus prepa...

Embodiment 2

[0029] The composition of the vertical conductive glue in the present embodiment is recorded as:

[0030] Silicone raw rubber: 30 parts; epoxy resin: 20 parts; conductive metal powder adopts 35 parts of gold-plated powder, nickel powder 15 parts; dispersant uses 0.5 parts of coupling agent.

[0031] The preparation method is as follows:

[0032] Step 1: Mix the raw silicone rubber and epoxy resin according to the proportion, put it into the internal mixer, heat at 150°C under vacuum, and stir for 20 minutes;

[0033] Step 2: Put the gold-plated powder, nickel powder and dispersant together into the mixer and stir for 30 minutes;

[0034] Step 3: Put the raw materials with a good ratio into the calender for calendering, and then bake and shape to obtain the finished vertical conductive adhesive.

[0035] According to the experimental test, the conductive blind spot of the vertical conductive adhesive thus prepared is reduced to the lowest value, the precipitation of the condu...

Embodiment 3

[0037] The composition of the vertical conductive glue in the present embodiment is recorded as:

[0038] Silicone raw rubber: 25 parts; epoxy resin: 25 parts; conductive metal powder adopts 33 parts of gold-plated powder, nickel powder 20 parts; dispersant uses 0.8 parts of modified silicone oil.

[0039] The preparation method is as follows:

[0040] Step 1: Mix the raw silicone rubber and epoxy resin according to the proportion, put it into the internal mixer, heat at 180°C under vacuum, and stir for 15 minutes;

[0041] Step 2: Put the gold-plated powder, nickel powder and dispersant together into the mixer and stir for 35 minutes;

[0042] Step 3: Put the raw materials with a good ratio into the calender for calendering, and then bake and shape to obtain the finished vertical conductive adhesive.

[0043] According to experimental tests, compared with the vertical conductive adhesive in the prior art, the vertical conductive adhesive thus prepared has significantly redu...

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PUM

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Abstract

The invention discloses a vertical conductive adhesive. The vertical conductive adhesive is prepared from, by weight, 25-35 parts of silica-gel rubber, 15-25 parts of epoxy resin, 45-55 parts of conductive metal powder and 0.2-0.8 part of a dispersing agent; the conductive metal powder is a mixture of 30-35 parts by weight of gold-plated powder and 15-20 parts by weight of nickel powder. The invention further discloses a preparation method of the vertical conductive adhesive. The method comprises the steps that the silica-gel rubber and the epoxy resin are mixed in proportion, the mixture is put into an internal mixer, heating is conducted under vacuum to reach the temperature of 120 DEG C to 180 DEG C, and the materials are stirred for 15 min to 25 min; the gold-plated powder, the nickel powder and the dispersing agent are put into a stirrer to be stirred for 25 min to 35 min; the proportioned raw materials are put into a slice-out calender to be rolled to obtain a slice, baking is conducted for shaping, and the finished vertical conductive adhesive product is obtained. According to the vertical conductive adhesive, conduction blind spots are reduced, and meanwhile conductive metal deposition can be reduced.

Description

technical field [0001] The invention relates to a vertical conductive adhesive, and also relates to a preparation method of the vertical conductive adhesive. Background technique [0002] Vertical conductive glue refers to a kind of conductive glue that is made conductive by vertical pressure. The structure of vertical conductive glue in the prior art is to randomly scatter and evenly mix a plurality of conductive powders with the weight of silica gel, and then arrange the powder of conductive powder. The particles are connected in series up and down to form a plurality of electrical connection points between the protrusions and the upper and lower surfaces of the silica colloid. [0003] The vertical conductive adhesives in the prior art generally have conduction blind spots and conductive powder deposition, which further affect the accuracy of test results. Contents of the invention [0004] The purpose of the present invention is to overcome the deficiencies in the pri...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/04C09J163/00C09J11/04C09J9/02
CPCC09J183/04C08K2201/001C08L2205/025C08L2205/03C09J9/02C09J11/04C08L63/00C08K2003/0831C08K2003/0862
Inventor 闫森源
Owner 强新正品(苏州)环保材料科技有限公司
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