Nano aluminum nitride heat radiation paint for LED lamp and preparation method thereof

Abstract

The invention provides a nano aluminum nitride heat radiation paint for an LED lamp, wherein the paint is prepared by the raw materials by weight (Kg): 30-34 parts of organic silicone resin, 12-14 parts of E-12 epoxy resin, 6-8 parts of methylenebiscyclohexanamine, 12-15 parts of nano aluminum nitride powder, 1-2 parts of hydroquinone, 4-5 parts of silane coupling agent KH550, 1-2 parts of cross-linking agent TAC, 2-3 parts of alumina, 2-3 parts of silicon carbide, 1-2 parts of sodium metasilicate, 1-2 parts of triethanolamine, 4-6 parts of PEVE fluorocarbon resin, 3-4 parts of glass bead, 1-2 parts of ammonium polyphosphate, 8-10 parts of xylene, 10-12 parts of ethyl acetate, and 4-5 parts of film forming auxiliary agent. Nano aluminum nitride powder is added so as to greatly raise heat conduction rate of the paint, and to make the paint have good heat radiation effect; silicon carbide is added so as to raise the wear resistance of the paint; the paint has advantages of large paint adhesion stress, not-easy shedding, and good fireproof performance; and the organic silicone resin is used as a base material, so as that the paint has good insulating property and excellent thermo-oxidative stability.

Description

technical field [0001] The invention belongs to the technical field of paint, and relates to a heat-dissipating paint, in particular to a nano-aluminum nitride heat-dissipating paint for LED lamps and a preparation method thereof. Background technique [0002] As LED technology has received widespread attention as a new generation of lighting technology in recent years, the power of LED has increased, and the heat dissipation problem has also attracted more and more attention. At present, most of the heat-conducting adhesives are used to solve the heat dissipation problem of LED lamps, but the materials used have technical problems such as poor temperature resistance and aging resistance, low adhesion to the substrate, poor heat dissipation effect and inconvenient operation, which are difficult to meet people's expectations. Requirements for heat dissipation of LED lamps. Some manufacturers also start to select materials with higher thermal conductivity, but this will incre...

AI Technical Summary

Problems solved by technology

At present, most of the heat-conducting adhesives are used to solve the heat dissipation problem of LED lamps, but the materials used have technical problems such as poor temperature resistance and aging resistance, low adhesion to the substrate, poor heat dissipation effect and inconvenient operation, which are difficult to meet people's expectations. Requirements for heat dissipation of LED lamps

Some manufacturers are also starting to use materials with higher thermal conductivity, but this will increase the production cost of LEDs