Method for preparing high-smelting-point hard particle dispersion strengthened copper-base composite material by liquid-phase sintering and electromagnetic sintering device
A technology of hard material particles and copper-based composite materials, which is applied in the field of powder metallurgy preparation methods and sintering devices of copper-based composite materials, can solve the problems of easily polluted interface of composite materials, inability to stably control the production process, complicated processes, and the like. Achieve the effect of low cost, increase effective viscosity and simple process
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Embodiment 1
[0027] In this example, alumina powder is used as the high melting point hard material for dispersion strengthening, and copper alloy is used to prepare copper-containing powder to make Cu-Al 2 o 3 Powder metallurgy is carried out on the prefabricated powder round billet to prepare a dense high-strength copper-based composite material billet of copper alloy dispersion-strengthened by high-melting-point hard material particles.
[0028] In this example, see figure 1 , the electromagnetic sintering device for the method of preparing high-melting-point hard material particles dispersion-strengthened copper-based composite material by liquid-phase sintering is composed of a heating and heat preservation device, an atmosphere control device and a constant magnetic field generating device 10, specifically:
[0029] The heating and heat preservation device is composed of a stainless steel furnace body 11, a crucible 5, a refractory fiber 6, a heating element 4, a temperature control...
Embodiment 2
[0034] This embodiment is basically the same as Embodiment 1, especially in that:
[0035] In this example, the copper powder and micro-alumina powder prepared in the above-mentioned Example 1 are replaced with copper powder with dispersed distribution of nano-alumina prepared by the internal oxidation method, without powder mixing, and directly pressed into a compact, and then the above-mentioned In the same liquid-phase sintering process as in Example 1, the magnetic induction intensity is controlled to 16T, the liquid-phase sintering temperature is 1100°C, and the temperature is kept at 10 hours, then a high-strength and high-conductivity copper alloy billet with nano-alumina dispersion strengthening can also be prepared. Then, various nano-alumina dispersion-strengthened copper alloy rods, pipes, plates or wires can be prepared by conventional rolling and drawing processes, and have excellent strength and electrical conductivity.
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