Epoxy resin pouring sealant

A technology of epoxy resin and potting glue, which is applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., and can solve problems such as weak voltage resistance, low hardness, and easy fatigue

Inactive Publication Date: 2013-10-23
ANHUI KANGRUIXIN ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, pure epoxy resin has a high cross-linked structure, so it has disadvantages such as brittleness, fatigue, poor heat resistance, and poor impact toughness. It overcomes the above shortcomings and is more widely used in the practical application of electronic device potting. However, the existing epoxy resin potting adhesives have shortcomings such as low hardness, poor thermal deformation, and weak voltage resistance. Improvement of existing epoxy resin potting compound

Method used

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  • Epoxy resin pouring sealant
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Such as figure 1 As shown, a kind of epoxy resin potting compound KRX300A / B of the present invention (KRX300 is the product model, A represents A component epoxy resin, B represents B component curing agent), when preparing A component epoxy resin KRX300A , calculated according to the weight ratio in the A component, first take the bisphenol A type epoxy resin whose weight ratio accounts for 88.8% of the A component weight (the following percentage figures have the same meaning unless otherwise specified), in Preheat at 40°C for 30 minutes, then place the bisphenol A type epoxy resin in the reaction kettle used to prepare component A, and then add 5% benzyl glycidyl ether and 4% butyl glycidyl ether to the reaction kettle A reactive diluent composed of glycidyl ether, and 0.2% defoamer is added. The defoamer is used to eliminate bubbles that may be contained in the preparation process to ensure product quality. The defoamer can be polysiloxane. According to the needs o...

Embodiment 2

[0039] The constituent components, stirring speed, stirring time, heating temperature and time, various detection procedures, and steps of use are all the same as those in Example 1, except for the specific content of each constituent component. When preparing A component epoxy resin, according to the weight ratio in A component, the weight of bisphenol A type epoxy resin accounts for 86.8% of A component weight (if no special instructions, the following percentage figures are all The same meaning as this), accounting for 6% of the weight of component A benzyl glycidyl ether and 5.05% of butyl glycidyl ether to form a reactive diluent, the defoamer accounts for 0.15% of the weight of component A, and 0.9% of white Powder, 1.1% blue powder, the weight ratio sum of the components of the above-mentioned component A epoxy resin is exactly 100%.

[0040] The preparation method of component B in this example, each component and its content, heating temperature and time are the same ...

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Abstract

The invention discloses an epoxy resin pouring sealant. The epoxy resin pouring sealant comprises the component A--an epoxy resin and the component B--a curing agent. The component A comprises, by weight, 85 to 89% of a bisphenol A epoxy resin, 3 to 13% of a diluent and 0.15 to 0.25% of a defoaming agent. The component B comprises a first raw material and a second raw material, wherein the first raw material comprises, by weight, 40% of 1,3-BAC, 20% of the bisphenol A epoxy resin and 40% of benzyl alcohol, the second raw material comprises, by weight, 50% of isophorone diamine, 15% of the bisphenol A epoxy resin and 35% of benzyl alcohol, and the first raw material and the second raw material with same weight are mixed and stirred to obtain the component B. A weight ratio of the component A to the component B is 2: 1. The sum of the upper limit value of any component of the component A and the lower limit value of the rest components is no more than 100%, and the sum of the lower limit value of any component of the component A and the upper limit value of the rest components is no less than 100%. The epoxy resin pouring sealant provided by the invention has improved hardness, thermal deformation, voltage resistance, etc.

Description

technical field [0001] The invention relates to an epoxy resin potting glue, in particular to an epoxy resin potting glue for packaging electronic devices such as storage batteries. Background technique [0002] Epoxy resin is a thermosetting resin with excellent chemical stability and corrosion resistance. It has good bonding performance, high mechanical strength, and strong electrical insulation. It has been widely used in industry, especially in electronic devices and transformers. It is widely used in the pouring and packaging of devices and other devices. However, pure epoxy resin has a high cross-linked structure, so it has disadvantages such as brittleness, fatigue, poor heat resistance, and poor impact toughness. It overcomes the above shortcomings and is more widely used in the practical application of electronic device potting. However, the existing epoxy resin potting adhesives have shortcomings such as low hardness, poor thermal deformation, and weak voltage res...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J163/02C09J11/06C08L63/02
Inventor 朱保瑞
Owner ANHUI KANGRUIXIN ELECTRONICS TECH
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