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Environment-friendly II-VI class soft fragile crystal grinding and polishing method

A II-VI, green and environmentally friendly technology, applied in the direction of grinding equipment, grinding machine tools, metal processing equipment, etc., can solve the problems of scratches that are difficult to remove, micro deformation, micro scratches, etc.

Inactive Publication Date: 2013-07-17
DALIAN UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method of free abrasive grinding and polishing makes abrasives easily embedded in the surface of the workpiece, once embedded it is difficult to remove
Even if it is removed, processing defects such as pits, micro-deformation, and micro-scratches will remain
The final chemical mechanical polishing method uses bromomethanol as the final etchant. Although it can remove the mechanically processed damage layer on the surface, it will leave corrosion grooves at the same time, and it is difficult for large scratches caused by free abrasive grinding. remove
[0004] Although soft and brittle crystals of the II-VI group are prone to various processing defects, the processed surface of the II-VI group semiconductor wafer requires no abrasive embedding, scratches, chipping, broken and other processing defects, and requires its surface roughness Reaching the sub-nanometer level, this harsh requirement poses a severe challenge to the field of precision ultra-precision machining in my country

Method used

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Embodiment Construction

[0016] The specific implementation manner of the present invention will be described in detail below in conjunction with the technical solutions.

[0017] Processing Wafers to Cd 0.96 Zn 0.04 Te(111) single wafer, the length, width and height are 10mm, 10mm and 1mm respectively. First, stick three cadmium zinc telluride wafers on a round aluminum alloy counterweight plate with paraffin wax, and evenly distribute them on the edge circumference. The aluminum alloy weight plate has a diameter of 80 mm and a thickness of 12 mm. The pressure is applied on the aluminum alloy weight plate until 17 kPa, and the pressurization method is to increase the same weight plate and string them together with bolts. Put #3000 corundum waterproof sandpaper on the glass disc, fix it with bolts and pressure ring, then put the glass disc on the cast iron plate, fix the pressure ring with bolts.

[0018] When grinding, the rotating speed of the weight plate and the sandpaper is 80 rpm, and the gr...

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Abstract

The invention belongs to the technical field of processing and manufacturing of II-VI class soft fragile crystals and discloses an environment-friendly II-VI class soft fragile crystal grinding and polishing method. The method is characterized in that samples are II-VI class soft fragile crystals, waterproof sand paper is made by adopting fixed abrasive, a fixed abrasive millstone is taken as a grinding tool, abrasive is one of alumium oxide, ceric oxide and silicon dioxide, the grain size is 2000-5000, the rotating speed of both a workpiece and a grinding disc is 40-80rpm, the pressure is 15-20kPa, grinding fluid is deionized water, grinding time is 3-10min, chemical mechanical polishing solution is composed of silica solution and hydrogen peroxide, the pH value of the silica solution is 6-8, the grain size of silicon dioxide is 50-80nm, pH regulator is one of orange juice, grapefruit juice, haw juice, tomato juice and lemon juice, the pH value of the polishing solution after being adjusted is 4-6, the rotating speed of both the workpiece and a polishing disc is 40-80rpm, the pressure is 20-30kPa, and the polishing time is 20-40min. The environment-friendly II-VI class soft fragile crystal grinding and polishing method has the advantage that environment-friendly grinding and polishing of the II-VI class soft fragile crystals are realized.

Description

technical field [0001] The invention discloses a green and environment-friendly grinding and polishing method for group II-VI soft and brittle crystals, which belongs to the technical field of processing and manufacturing II-VI group soft and brittle crystals, and in particular relates to a method for processing semiconductor wafers of II-VI group soft and brittle crystals. Background technique [0002] II-VI group soft and brittle crystals are widely used in military, national defense, aerospace and other high-tech fields, and have become the focus and hotspot of research at home and abroad. CdZnTe and HgCdTe are typical representatives of II-VI group soft and brittle crystals. Cadmium zinc telluride is the preferred material for room temperature nuclear radiation detectors, and it is also an ideal material for mercury cadmium telluride infrared thin film substrates. Mercury cadmium telluride is the material of choice for infrared detectors, especially the most widely used...

Claims

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Application Information

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IPC IPC(8): B24B37/00B24B37/34
Inventor 张振宇康仁科宋亚星郭东明
Owner DALIAN UNIV OF TECH
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