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Method for reducing contact resistance based on low-melting-point metal and oxide thereof

A low-melting-point metal and contact resistance technology, applied in the direction of metal/alloy conductors, circuits, connections, etc., can solve the problems of limited effect of filling conductive paste on the contact interface, increased maintenance costs, limited conductivity, etc., to improve power transmission efficiency, The effect of prolonging the service life of equipment and improving the efficiency of electric energy use

Active Publication Date: 2013-04-24
郭瑞
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Second, the contact surface will form an oxide film with poor conductivity in the air and adhere to the surface, increasing the resistance
The cost of changing the contact surface material is high, and the performance improvement is small; cleaning the oxide film on the contact surface increases the maintenance cost, and the feasibility is not high; the effect of filling the contact interface with conductive paste is limited. The main reason is that the basic materials of the current conductive paste are all non-metallic. very limited conductivity

Method used

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  • Method for reducing contact resistance based on low-melting-point metal and oxide thereof

Examples

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Embodiment 1

[0021] The invention provides a method for reducing contact resistance by using low melting point metal and its oxide. Such as figure 1 As shown, the component consists of fastening screws 1, a mixture of low melting point metals and their oxides 2, two smooth rectangular electrical connectors (that is, metal sheets with screw holes) 3, 4. The size of the electrical connector 3 is 6cm×3cm×1cm; the size of the electrical connector 4 is 6cm×3cm×1cm. The electric connector 3 and the electric connector 4 are made of red copper (in addition, they can also be aluminum or stainless steel); the fastening screw 1 is made of brass.

[0022] The conductive paste (mixture 2 of low melting point metal and its oxide) of the present invention is composed of gallium indium tin alloy and gallium oxide, wherein the mass fraction of gallium oxide is 1%. When in use, evenly coat the mixture 2 of the low melting point metal and its oxide on the contact surface of the metal sheet 3 and make it fu...

Embodiment 2

[0025] The invention provides a method for reducing contact resistance by using low melting point metal and its oxide. Such as figure 1 As shown, the component consists of fastening screws 1, a mixture of low melting point metals and their oxides 2, two smooth rectangular electrical connectors (that is, metal sheets with screw holes) 3, 4. The size of the electrical connector 3 is 10 cm×5 cm×1 cm; the size of the electrical connector 4 is 10 cm×5 cm×1 cm. The electric connector 3 and the electric connector 4 are made of stainless steel (in addition, they can also be aluminum or copper); the fastening screw 1 is made of brass.

[0026] The conductive paste (mixture 2 of low melting point metal and its oxide) of the present invention is composed of gallium indium copper bismuth alloy, gallium oxide and indium oxide, wherein the mass fraction of gallium oxide is 2%, and the mass fraction of indium oxide is 1%. When in use, evenly coat the mixture 2 of the low melting point meta...

Embodiment 3

[0029] The invention provides a method for reducing contact resistance by using low melting point metal and its oxide. Such as figure 1 As shown, the component consists of fastening screws 1, a mixture of low melting point metals and their oxides 2, two smooth rectangular electrical connectors (that is, metal sheets with screw holes) 3, 4. The size of the electrical connector 3 is 8cm×8cm×4cm; the size of the electrical connector 4 is 8cm×8cm×4cm. The electric connector 3 is made of stainless steel, the electric connector 4 is made of red copper; the fastening screw 1 is made of brass.

[0030] The conductive paste (mixture 2 of low melting point metal and its oxide) of the present invention is composed of gallium-tin-silver-copper alloy, gallium oxide and copper oxide, wherein the mass fraction of gallium oxide is 3%, and the mass fraction of copper oxide is 1%. When in use, evenly coat the mixture 2 of the low melting point metal and its oxide on the contact surface of the...

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Abstract

The invention relates to a method for reducing contact resistance based on low-melting-point metal and an oxide thereof. By coating the low-melting-point metal and the oxide thereof between electric terminals connected with machinery, the contact resistance between the mechanical electric terminals is reduced effectively. The invention further relates to a conductive paste composing of the low-melting-point metal and the oxide thereof. The oxide takes 0.05% to 50% of the total weight of the conductive paste. The low-melting-point metal is one type or a combination of any two types selected from sodium, potassium, lithium, rubidium, cesium, gallium, indium, mercury, lead bismuth alloy, gallium-base binary alloy, gallium-base complex alloy, indium-base alloy, bismuth-base alloy, mercury-base alloy and sodium-potassium alloy which are lower than 200 DEG C in melting point. With the compound of the low-melting-point metal and the oxide thereof as the conducting medium, the method for reducing contact resistance can effectively reduce the contact resistance between the electric terminals connected with the machinery, significantly reduce the contact resistance heat effect, improve transmission efficiency of electric energy and prolong the service life of the machinery. The method for reducing contact resistance based on the low-melting-point metal and the oxide thereof can be widely applied to the technical fields of electric power and energy.

Description

technical field [0001] The invention relates to a method for reducing contact resistance, in particular to a method for reducing contact resistance by using low-melting point metals and oxides thereof. Background technique [0002] There are two main reasons for the contact resistance: first, due to the unevenness of the contact surface, the actual contact surface of the metal is reduced, and when the current flows through the conductor, the effective conductive interface of the contact surface is reduced. Second, the contact surface will form a layer of poorly conductive oxide film attached to the surface in the air, increasing the resistance. The size of the contact resistance affects the size of the contact voltage drop, and the voltage drop increases with the increase of the contact resistance, and the change of the voltage directly affects the normal operation of the equipment. The electric energy consumed by the contact resistance will be transformed into heat energy,...

Claims

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Application Information

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IPC IPC(8): H01R43/00H01B1/02
CPCH01B1/02H01R4/304H01R4/34
Inventor 郭瑞考笑梅钟磊
Owner 郭瑞
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