Latent-curing conductive paste and method of forming electrode on substrate thereby
A conductive paste, curing technology, applied in the direction of conductive materials, circuits, electrical components, etc. dispersed in non-conductive inorganic materials, can solve the problems of affecting printing quality, circuit deformation, poor temperature resistance, etc., to achieve excellent anti-corrosion Sagginess, convenient storage and transportation, and the effect of overcoming high environmental temperature sensitivity
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Embodiment 1
[0019] The invention is a latent curing conductive paste, which contains low melting point thermoplastic polymer, silver powder, glass powder, auxiliary agent, curing reaction agent and curing catalyst; the weight percentage of each component is: 30% low melting point thermoplastic polymer , 45% silver powder, 4% glass powder, 5% auxiliary agent, 15% curing reaction agent, 1% curing catalyst, wherein, the low melting point thermoplastic polymer is a long straight chain primary alcohol containing 15 carbons, the curing Reactant is the polyvinyl alcohol containing double-end epoxy group; Described curing catalyst is triethylamine; Described auxiliary agent is the mixture of stearic acid and ethyl cellulose by weight ratio 1: 9; Described silver powder is Tap density greater than 5 g / cm 3 1. Spherical silver powder with an average particle size of 0.1-2 μm; the glass powder is a general-purpose glass powder for solar cell electronic paste.
[0020] The method of using the latent...
Embodiment 2
[0022] A latent curing type conductive paste, which contains low melting point thermoplastic polymer, aluminum powder, glass powder, auxiliary agent, curing reaction agent and curing catalyst; the weight percentage of each component is: 10% low melting point thermoplastic polymer, 70% % aluminum powder, 10% glass powder, 4.99% auxiliary agent, 5% curing reaction agent, 0.01% curing catalyst, wherein, the low melting point thermoplastic polymer is a long linear primary alcohol containing 20 carbons; the curing reaction The agent is polyvinyl alcohol containing two-terminal epoxy groups; the curing catalyst is tripropylamine; the auxiliary agent is a mixture of stearic acid and acrylic resin in a weight ratio of 1: 4; the aluminum powder is a tap density Greater than 1.3 g / cm 3 1. Spherical aluminum powder with an average particle size of 0.1-2.0 μm; the glass powder is a general-purpose glass powder for solar cell electronic paste.
[0023] The method of using the latent curin...
Embodiment 3
[0025] A latent curing type conductive paste, which contains low melting point thermoplastic polymer, silver powder, glass powder, auxiliary agent, curing reaction agent and curing catalyst; the weight percentage of each component is: 40% low melting point thermoplastic polymer, 30% Silver powder, 1% glass powder, 8% auxiliary agent, 20% curing reaction agent, 1% curing catalyst, wherein, the low-melting thermoplastic polymer is a long linear primary alcohol containing 16 carbons; the curing reaction agent is The polyvinyl alcohol of two-terminal epoxy group; The curing catalyst is tripropylamine; The auxiliary agent is the mixture of stearic acid, methyl cellulose ether and acrylic resin in a weight ratio of 1: 5: 4; The silver powder The tap density is greater than 4.5 g / cm 3 , flaky silver powder with an average particle size of 0.1-1.0 μm and a tap density greater than 5 g / cm 31. A mixture of spherical silver powder with an average particle size of 0.1-2 μm at a weight ra...
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