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A kind of room temperature curing epoxy resin composition and preparation method thereof

A technology of epoxy resin and room temperature curing, which is applied in the field of room temperature curing epoxy resin composition and its preparation, can solve the problems of insufficient toughness and poor high temperature resistance of room temperature curing epoxy resin, and solve the problem of excessive room temperature curing time, Good thermal stability and good weather resistance

Active Publication Date: 2015-11-18
北京蓝星清洗有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The invention provides a room temperature curing epoxy resin composition and its preparation method, which solves the technical problems of insufficient toughness and poor high temperature resistance of room temperature curing epoxy resin

Method used

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  • A kind of room temperature curing epoxy resin composition and preparation method thereof
  • A kind of room temperature curing epoxy resin composition and preparation method thereof
  • A kind of room temperature curing epoxy resin composition and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026]Example 1: 10.0g hydantoin epoxy resin MHR-070 (purchased from Wuxi Meihua Chemical Co., Ltd., epoxy value 0.70-0.74), 90.0g bisphenol A glycidyl ether epoxy resin E-51 (Purchased from Wuxi Resin Factory of Blue Star Chemical New Materials Co., Ltd., epoxy value is 0.48-0.54) Mechanically stir and disperse at 800 rpm at 25°C for 5 minutes, add 5g of 1,4-butyl in turn while stirring Diol diglycidyl ether, 0.5g γ-glycidyl etheroxypropyl trimethoxysilane, mechanically stirred at a speed of 800 rpm to disperse for 10 minutes, then stand at room temperature for use, mix 15.0g polyetheramine D230 and 20.0 g triethylenetetramine was mechanically stirred and dispersed at room temperature at a speed of 600 rpm for 5 minutes, and 0.5 g of 2,4,6-tris(dimethylaminomethyl)phenol, 0.08 g of tetrakis[β-( 3,5-di-tert-butyl-4-hydroxyphenyl) propionate] pentaerythritol ester and 0.02 g of didodecyl thiodipropionate were mechanically stirred and dispersed at a speed of 600 rpm at room temp...

Embodiment 2

[0027] Example 2: 30.0g hydantoin epoxy resin MHR-070 (purchased from Wuxi Meihua Chemical Co., Ltd., epoxy value 0.70-0.74), 70.0g bisphenol A glycidyl ether epoxy resin E-51 (purchased from Wuxi Resin Factory of Bluestar Chemical New Materials Co., Ltd., epoxy value is 0.48-0.54) Mechanically stir and disperse at 900 rpm at 30°C for 8 minutes, and add 5.0g of 1,4- Butanediol diglycidyl ether, 2.5g γ-glycidyl ether oxypropyltrimethoxysilane, mechanically stirred at a speed of 900 rpm to disperse for 10 minutes, then left to stand at room temperature for use, 5.0g polyetheramine D230 and 10.0g of triethylenetetramine was mechanically stirred and dispersed at room temperature at a speed of 600 rpm for 5 minutes, and 3.0g of 2,4,6-tris(dimethylaminomethyl)phenol, 0.0095g of tetrakis[β- (3,5-di-tert-butyl-4-hydroxyphenyl)propionic acid]pentaerythritol ester and 0.0005g of didodecyl thiodipropionate were dispersed by mechanical stirring at a speed of 600 rpm at room temperature fo...

Embodiment 3

[0028] Example 3: 20.0g hydantoin epoxy resin MHR-070 (purchased from Wuxi Meihua Chemical Co., Ltd., epoxy value 0.70-0.74), 80.0g bisphenol A glycidyl ether epoxy resin E-51 (Purchased from Wuxi Resin Factory of Blue Star Chemical New Materials Co., Ltd., epoxy value is 0.48-0.54) Mechanically stir and disperse at 1000 rpm at 27°C for 8 minutes, while stirring, add 5.0g of cyclohexane Alcohol diglycidyl ether, 3.0g γ-(methacryloyloxy)propyltrimethoxysilane, mechanically stirred at a speed of 1000 rpm to disperse for 10 minutes, then stand at room temperature for use, and 2.0g polyetheramine D230, 8.0g of polyetheramine D2000 and 15.0g of tetraethylenepentamine were mechanically stirred and dispersed at room temperature at a speed of 700 rpm for 10 minutes, and 2.5g of boron trifluoride ethylamine and 0.04g of tetra[β -(3,5-di-tert-butyl-4-hydroxyphenyl)propionic acid]pentaerythritol ester and 0.005g of didodecyl thiodipropionate were mechanically stirred at a speed of 700 rp...

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Abstract

The invention relates to a room temperature curing epoxy resin composition and a preparation method thereof. The room temperature curing epoxy resin composition is characterized by comprising a component A and a component B, wherein the component A comprises the following ingredients: 100 parts of epoxy resin, 5-10 parts of diluent, and 0.5-3 parts of silane coupling agent; the component B comprises the following ingredients: 15-35 parts of amine curing agent, 0.1-3.0 parts of accelerant and 0.01-0.1 part of antioxidant. Blend epoxy resin of a hydantoin epoxy resin and a low-viscosity epoxy resin (at least one of bisphenol-A and bisphenol-F diglycidyl ether epoxy resins) is used as a resin matrix. Therefore, not only can the demand of vacuum leading-in and forming of a fiber reinforced composite material on low viscosity of the resin be met, but also the composite product can have excellent high-temperature resistance.

Description

technical field [0001] The invention relates to a room temperature curing epoxy resin composition and a preparation method thereof. Background technique [0002] Epoxy resin has the advantages of excellent mechanical properties, electrical insulation, chemical stability, low shrinkage rate, easy processing and molding, and low cost. It is currently a widely used fiber-reinforced composite material with superior performance. [0003] However, since the room temperature (18-25°C) curing system often reacts too slowly, the efficiency is not high, and the reaction is not complete, the room temperature curing epoxy system has many disadvantages, such as epoxy resins are mostly brittle after curing and have toughness. Insufficient shortcomings, can not effectively play the performance of the reinforced fiber, often due to the premature failure of the epoxy resin when bearing the load, resulting in the destruction of the composite material. [0004] In addition, most of the room t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L63/02C08K5/00C08K5/1515C08K5/544C08K5/5435C08K5/5425C08G59/50C08G59/30
Inventor 刘欣彤孟秀青杨刚胡伟
Owner 北京蓝星清洗有限公司
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