Polymeric thin-film material ozone treatment graft modification chemical copper plating method

Abstract

The invention discloses a polymeric thin-film material ozone treatment graft modification chemical copper plating method. The method comprises the steps of (1), washing; (2), performing ozone treatment; (3) performing chemical grafting and placing processed polymeric thin films into a water solution of acrylamide CH2=CHCONH2, ceric ammonium nitrate Fe(NH4)2(NO3)6 and ammonium ferrous sulfate Fe(NH4)2(SO4)2.6H2O; (4), performing activation and placing the grafted polymeric thin films into a solution of 0.1-1g / L of silver nitrate AgNO3 and 10-15mL / L37% of ammonia water BH3.H2O and immersing for 10-60s; and performing chemical copper plating, placing the activated thin films into chemical copper plating liquid and subjecting the thin films and the solution to reaction for 10-20min. The polymeric thin-film material ozone treatment graft modification chemical copper plating method has the advantages that the method is simple, practical, economical and environment-friendly, chemical copper plating can be performed on a polyethylene terephthalate (PET) thin film, the copper plating liquid is not required to be heated, and the method can be conducted at a normal temperature, and the like.

Description

technical field [0001] The invention relates to a polymer film surface treatment process, in particular to a method for grafting and modifying electroless copper plating of a polymer film material by ozone treatment. Background technique [0002] At present, the circuit board industry mainly uses the subtractive method to produce soft boards, that is, to adhere a layer of copper foil on the polyimide or polyethylene terephthalate substrate, and then corrode the unnecessary parts according to the circuit diagram. Lose. This method is a waste of copper resources, and the waste liquid is difficult to handle and pollutes the environment. So it is imminent to develop a method that can directly plate copper on PET film. [0003] So far, there is only one patent for direct electroless copper plating on PET film. The Chinese invention patent with application number 201110043365.9 and application date of February 23, 2011 discloses a palladium-free electroless copper plating on pol...

AI Technical Summary

Problems solved by technology

The advantage of this patent is that photografting can be used to obtain a higher grafting rate. The disadvantage is that the gas-phase photografting reaction is relatively slow, and a toxic acetone-loaded catalyst is used. Nitrogen protection gas must be introduced during the reaction, and because the film only Under single-sided irradiation, only the side receiving the light source can be plated with copper during electroless copper plating, which is not suitable for double-sided panel production

These deficiencies still need to be improved