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Method for adhering large-scale plane targetto back plate

A bonding method and flat target technology, which are used in welding equipment, non-electric welding equipment, metal processing equipment, etc., can solve the problems of high working temperature, deformation of target materials, and difficulty in meeting the requirements of bonding strength, so as to improve the bonding rate, The effect of reducing the amount of bubbles and being easy to promote and apply

Inactive Publication Date: 2012-10-03
YANTAI SHIELD ADVANCED MATERIALS
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  • Summary
  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For large targets, the bonding strength of the target components obtained by brazing bonding is difficult to meet the requirements; and when diffusion welding is used, the working temperature required for welding is high, and the target is prone to deformation during the welding process

Method used

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  • Method for adhering large-scale plane targetto back plate
  • Method for adhering large-scale plane targetto back plate
  • Method for adhering large-scale plane targetto back plate

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Embodiment Construction

[0024] In order to better understand and implement the present invention, the present invention will be further described below in conjunction with specific examples.

[0025] Such as figure 1 , 2 As shown, a bonding method for a large planar target and a backplane includes the following four steps in sequence:

[0026] Ⅰ. Pre-bonding treatment: Grinding the surface of the target material 3 and the back plate 1, so that the surface roughness reaches 0.32 μm to 0.8 μm, the flatness tolerance is less than ±0.1mm, and the external dimension tolerance is controlled to be less than ±0.2 mm; then several layers of transition material are plated on the bonding surface; the transition material refers to a metal whose thermal expansion coefficient is between the target material 3 and the back plate 1, such as Cr, Ni, etc.

[0027] Ⅱ. Pre-coating solder: heat the backplane 1 and target 3 to a temperature 10-50°C higher than the liquidus of the solder, and then coat the solder on the s...

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Abstract

The invention relates to a method for adhering large-scale plane target to a back plate. The method comprises the following steps of processing before adhering, pre-coating welding flux, adhering, and processing after adhering in sequence. In the step of pre-coating the welding flux, the two opposite surfaces to be adhered are coated with the welding flux which is uniformly distributed, and then the fishbone welding flux is pre-coated on any adhering surface or fishbone welding flux preformed units are arranged on any adhering surface. The target can be steadily adhered with the back plate in the atmosphere and vacuum environment by using the method, so that the structure property and the size of the target cannot be influenced by adhesion, and the purposes that the adhesion has the properties of high bonding strength, high thermal conductivity and high electricity conductivity can be realized with low cost and easiness of operation.

Description

technical field [0001] The invention relates to a bonding method for a large planar target material and a back plate. Background technique [0002] Sputtering coating is widely used in related industries such as electronic information, solar energy, lithium-ion thin film batteries, storage records, and flat-panel displays. In the application fields such as flat display and solar energy, the size of the target is getting larger and larger. For example, the flat target used in the 5th generation line of TFT-LCD liquid crystal display is about 1700mm long and 1400mm wide. Such a target is made of low melting point such as indium When solder is bonded, a large number of air bubbles often appear in the weld seam. These air bubbles affect the conduction of heat, and in severe cases, it will cause off-target phenomenon. Therefore, the bonding technology of large targets and backplanes has become a key technology for target production. [0003] In the process of target sputtering,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K20/14B23K20/24
Inventor 王广欣钟小亮豆帆
Owner YANTAI SHIELD ADVANCED MATERIALS
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