Reflow defoaming system of electroplating process tank

Abstract

The invention discloses a reflow defoaming system of an electroplating process tank. The system involves an upper tank body, a flow guiding tank body, a lower tank body, a overflow box and a defoamingdevice, wherein the upper tank body is provided with a through port for allowing a to-be-plated board to pass through, the flow guiding body is arranged on one side of the upper tank body and communicates with the upper tank body through the through port, the lower tank body is located below the upper tank body, the bottom of the lower tank body is provided with a partition plate for partitioningthe interior space of the lower tank body into a reflow area and a defoaming area, a bubble layer above the electroplating liquid or cleaning liquid in the reflow area overflows from the top of the partition plate and enters the defoaming area, the overflow box communicates with a plate passing liquid discharging port at the side, opposite to the upper tank body, of the flow guiding tank body, the lower part of the overflow box communicates with a drainage pipe leading to the reflow area, the defoaming device is located above the defoaming area, and a negative pressure area is formed above the defoaming area to suck air bubbles in the reflow area and perform shear elimination on the bubbles. According to the system, a overflow pipe is arranged between the upper tank body and the lower tank body, the partition board and the defoaming device are arranged in the lower tank body, bubbles in the electroplating solution or cleaning liquid obtained by reflow can be eliminated, and the influence of bubbles on the electroplating quality of the product is reduced.

Description

technical field [0001] The invention relates to the technical field of electroplating equipment, in particular to a reflux defoaming system for an electroplating process tank. Background technique [0002] The common vertical electroplating equipment drives the circuit board to run along the electroplating tank filled with electroplating solution through the circulating transmission device. The circuit board continuously enters from one end of the electroplating tank and outputs from the other end. The electroplating ions in the electroplating solution are Electroplating is done on the surface of the circuit board during this process. [0003] The current electroplating process tank includes an electroplating tank located in the upper part for electroplating the circuit board, a liquid storage tank located in the lower part for recycling the electroplating solution, and a return tank located between the electroplating tank and the liquid storage tank. The electroplating tank...

AI Technical Summary

Problems solved by technology

[0007] Therefore, the technical problem to be solved in the present invention is to overcome the problem that the electroplating solution in the plating solution circulation system of the electroplating tank in the prior art is easy to generate bubbles when reflowing, thereby affecting the electroplating quality of the product, thereby providing an electroplating process tank. Reflux defoaming system

Images