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PTC thermistor and substrate applied therein and manufacturing method thereof

A technology of thermistor and manufacturing method, applied in the direction of resistors with positive temperature coefficient, etc., can solve the problems of poor ability to withstand high current multiple shocks, low PTC strength, etc., and achieve the ability to withstand high current multiple shocks Good, low resistance, the effect of inhibiting agglomeration

Inactive Publication Date: 2012-10-10
深圳市长园维安电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The technical problem to be solved by the present invention is to overcome the shortcomings of the existing PTC thermistors such as low PTC strength and poor ability to withstand multiple impacts of large currents, and provide a PTC with high strength and strong ability to withstand multiple impacts of high currents. PTC thermistor and its applied base material and its manufacturing method

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  • PTC thermistor and substrate applied therein and manufacturing method thereof

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preparation example Construction

[0061] The present invention also proposes the second preparation method of the thermistor, which includes the following steps:

[0062] Step 1: Preheat the conductive filler and auxiliary filler at 70-180°C for 2-24 hours for use;

[0063] Step 2: Pre-mix a polymer material, auxiliary fillers, and antioxidants to make a masterbatch. After mixing with another polymer material at room temperature, it will be mixed with conductive fillers, coupling agents, crosslinking agents, and sensitizers. The crosslinking agent is mixed at a temperature of 30-60°C above the melting point of the polymer material and then extruded or hot-pressed by a single-screw extruder;

[0064] Step 3: The metal electrodes are combined on the upper and lower surfaces of the sheet by hot pressing, and heat treatment is carried out. The chips are punched on a punch and subjected to gamma rays, electron accelerators or cobalt sources (Co 60 ) Perform radiation cross-linking, the radiation dose is 70~200KGY;

[0065]...

Embodiment 1

[0069] The conductive filler and auxiliary filler are pre-heated in a 110 degree oven for 4 hours, and then the conductive filler: carbon black (VXC200 model produced by Cabot, USA) 660g,

[0070] Auxiliary filler: 600g magnesium hydroxide,

[0071] Coupling agent: vinyl triethoxy silane 24g

[0072] Mix it evenly in a high-speed mixer, and combine the above mixture with high-density polyethylene 1000g,

[0073] Crosslinking agent: DCP (Dicumyl Peroxide) 3.6g,

[0074] Sensitizing crosslinking agent: 30g of trimethylolpropane triacrylate,

[0075] Antioxidant: Tetra [methyl-β-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate] pentaerythritol ester (antioxidant 1010) 4g, and tris(2,4-diphosphite) Tert-butylphenyl) ester (antioxidant 168) 12g,

[0076] Add to the internal mixer for mixing at 180°C. After the mixing time is 10 minutes, the material is discharged and crushed. The crushed material is uniformly mixed at room temperature and then mixed in a twin-screw extruder. The temperature of ...

Embodiment 2

[0083] The conductive filler and auxiliary filler are preheated in a 110 degree oven for 4 hours, and then the conductive filler: carbon black (VXC605 model produced by Cabot, USA) 460g,

[0084] Auxiliary filler: 800g alumina,

[0085] Mix well at room temperature, then combine the above mixture with

[0086] Polymer material: high density polyethylene 800g,

[0087] Sensitizing crosslinking agent: trimethylolpropane trimethacrylate 20g,

[0088] Add to the internal mixer for mixing at 180°C. After the mixing time is 10 minutes, the material is discharged and crushed. The crushed material is uniformly mixed at room temperature and then mixed in a twin-screw extruder. The temperature of each section of the extruder Respectively set to 170℃180℃190℃200℃, extrude the sheet into a sheet with a thickness of 1.6mm;

[0089] The nickel foil that has been roughened on one side is laminated on the upper and lower surfaces of the above-mentioned sheet by a flat vulcanizer, the pressure is 8MPa, a...

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Abstract

A PCT thermistor comprises a substrate and two tinsel-shaped electrodes which are combined with two surfaces of the substrate. The substrate is made of the following components in weight percentage: 28-55% of high-polymer material; 22-32% of conductive filling material; 13-46% of auxiliary filling material; and 1-5% of auxiliary agent in processing. The high-polymer material is obtained through mixing one or multiple materials selected from: polyethylene, polypropylene, maleic anhydride grafted polyethylene, ethane-vinyl acetate copolymer, ethane-acrylic acid copolymer, polyvinylidene fluoride, polycaprolactam, polyhexamethylene adipamide, polydecamethylene sebacamide and polyundecylamide. The auxiliary agent in processing is one component or a mixture of multiple components selected from: an anti-oxidant, a coupling agent, a cross-linking agent and a sensitized cross-linking agent. The sensitized cross-linking agent is one component or multiple components selected from the unsaturated compounds of multiple functional groups with higher decomposition temperature. The PTC thermistor of the invention has the following advantages: high strength, and high resistance for multiple timesof large current impact.

Description

Technical field [0001] The invention relates to a thermistor and a manufacturing method thereof, in particular to a manufacturing method of a polymer positive temperature coefficient thermistor. Background technique [0002] The polymer positive temperature coefficient resettable thermistor is the polymer PTC (Positive Temperature Coefficient, positive temperature coefficient) thermistor. It is a new type of functional material developed in the 1990s, mainly composed of high insulation A composite of molecular polymer materials and conductive fillers can exhibit a positive temperature coefficient (PTC) characteristic, that is, the resistivity increases significantly with the increase of temperature. At room temperature, this type of resistor has a relatively low resistance value. When the temperature rises to the melting point of the polymer substrate, the resistivity begins to rise rapidly, and the resistance value can quickly increase to more than 4 orders of magnitude. [0003]...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01C7/02
Inventor 覃迎峰连铁军晏国安
Owner 深圳市长园维安电子有限公司
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