Fire-retardant resin-based copper clad laminate and preparation method thereof

Abstract

The invention relates to a fire-retardant resin-based copper clad laminate and a preparation method thereof. The method comprises: adding a modified silica foam system into a bifunctional epoxy system, stirring for 50 min at a temperature of 130 DEG C, adding a monofunctional epoxy system and nanometer titanium dioxide crystal whisker at a room temperature, and stirring for 30 min to obtain a glueliquid; adjusting the solid content of the glue liquid to 55-60% with PMA, and impregnating with a reinforcing material to obtain a prepreg; heating and drying the prepreg to obtain a semi-curing sheet; and placing the semi-curing sheet between two copper foil sheets, and carrying out hot pressing molding so as to obtain the fire-retardant resin-based copper clad laminate, wherein the obtained fire-retardant resin-based copper clad laminate has excellent flame retardancy and excellent heat resistance, such that the development application of fire-retardant resin-based copper clad laminates can be met.

Description

technical field [0001] The invention belongs to the technical field of electronic composite materials, and in particular relates to a flame-retardant resin-based copper-clad laminate and a preparation method thereof. The obtained product can be used in the fields of aerospace, signal transmission, and electronic communication. Background technique [0002] The printed circuit board is formed by the copper clad laminate after the circuit is made. The copper clad laminate is obtained by hot pressing the glass cloth and the resin layer and the conductor layer attached to the glass cloth. Therefore, the main performance of the PCB board, especially the signal transmission performance, only needs CCL decision, while the performance of CCL has a great relationship with the resin matrix. With the development of light, thin, small, high-density, and multi-functional electronic products, the assembly density and integration of components are getting higher and higher, the frequency o...

AI Technical Summary

Problems solved by technology

The introduction of phosphorus-containing compounds into the resin matrix for preparing copper-clad laminates has become the main technical route for halogen-free flame-retardant copper-clad laminates. The resulting panels have low heat and humidity resistance

Simple resins can no longer meet the application of copper clad laminates. Even cyanate resins with better heat resistance have excellent dielectric properties (dielectric coefficient: 2.8-3.2; dielectric loss factor: 0.002-0.003), high Heat resistance (glass transition temperature: 280 ~ 295 ° C), while cyanate resin also has low shrinkage, excellent mechanical properties and bonding properties, etc., but also due to defects such as insufficient curing and brittleness, it has not been used in copper clad laminates. A large number of applications in the field

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