Heatproof resin composite material and preparation method thereof
A composite material and heat-resistant resin technology, applied in the field of heat-resistant resin composite materials and their preparation, to achieve the effects of good compatibility, good mechanical properties and high purity
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Embodiment 1
[0026] Embodiment 1 A molding compound for heat-resistant resin composite materials, the preparation method of which comprises the following steps:
[0027] (1) At room temperature, mix 3,3'-dithiodipropionic acid, dichloromethane, and acetone; then add pyridinium m-nitrobenzenesulfonate and manganese acetate, stir for 30 minutes, and then add N-methylolpropene Amide, after stirring for 3 hours, add 2,3-epoxy cyclopentyl cyclopentyl ether, after stirring for 50 minutes, add methylcyclohexene tetracarboxylic dianhydride, continue stirring for 20 minutes; then add N, N' -dicyclohexylcarbodiimide, continue to stir for 10 minutes to obtain monofunctional epoxy system;
[0028] (2) Mix nano-hollow alumina and isomeric undecyl alcohol polyoxyethylene ether for 30 minutes, then add it to diglycidyl phthalate, stir at 125°C for 20 minutes, then add 1,8-octanedithiol, Stir at 130°C for 50 minutes to obtain a bifunctional epoxy system;
[0029] (3) Add the monofunctional epoxy system ...
Embodiment 2
[0032] The molding compound prepared in Example 1 was hot-pressed to obtain a heat-resistant resin composite material. The hot-pressing conditions were 0.8MPa / 130°C / 30min+1.2MPa / 170°C / 40min+1.8MPa / 190°C / 3min+200°C / 10min, the performance test is shown in Table 1.
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