Radiation cured adhesive for indium tin oxide (ITO) circuit and module protection

Abstract

The invention provides a radiation cured adhesive for indium tin oxide (ITO) circuit and module protection, which comprises the following components in percentage by mass: 30 to 70 percent of polysiloxane-acrylic ester, 10 to 50 percent of polyester acrylate, 0 to 40 percent of reactive diluent, 0.2 to 8 percent of photoinitiator, 0.1 to 5 percent of coupling agent, 0 to 2 percent of antiaging agent and 0 to 2 percent of defoamer, wherein the reactive diluents is an acrylate with a single(double or multiple) functional group; the photoinitiator is a cracking initiator, a hydrogen abstracting type initiator or a combination of the two; the coupling agent is a silane coupling agent; and the antiaging agent is one or several of a phenol antioxygen, an amine antioxygen, a sulfur compound antioxygen, a phosphorus compound antioxygen and an organic metal salt antioxygen. In the curing process of the adhesive, moisture is not required to participate in reaction, the adhesive can be cured quickly in the irradiation of ultraviolet, and then package can be accomplished; and thus, the production efficiency is improved greatly, energy is saved and raw material cost is reduced.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and in particular relates to an adhesive for protecting COG, COF, and TAB modules of LCD liquid crystal screens, in particular to a radiation-cured adhesive for protecting ITO circuits and modules. Background technique [0002] In the LCD panel manufacturing process, it can be roughly divided into three stages, which are Array process, Cell process and Module process. The Array process refers to the fabrication of thin-film transistors (TFT) and color filters (CF) on a glass substrate; the Cell process uses the glass substrate of the TFT as the substrate, and combines it with the glass substrate of the CF. Liquid crystal (ODF process) is dripped between the substrates and the backlight plate is bonded to form an LCD panel (LCD panel); while the Module process is to assemble the driver IC, flexible circuit and some mechanical parts after inspecting the appearance of the LCD panel, and finally A...

AI Technical Summary

Problems solved by technology

However, the curing time of RTV-1 is long, and it takes at least 48 hours to completely cure, which seriously affects the production efficiency; moreover, corrosive gases, such as acetic acid, etc. will be generated during room temperature vulcanization, which will cause damage to ITO circuits and IC chip modules. Corrosion; In addition, RTV-1 has poor fluidity, and it is prone to corner shrinkage during construction, thereby reducing the one-time yield rate, high rework rate, and wasting manpower and material resources; RTV-1 colloid has poor strength and weak adhesion. Reliability will cause hidden dangers; RTV-1 cannot pass the environmental test of high and low temperature impact for 1000 hours, high temperature and high humidity lighting test for 1000 hours, and cannot be applied to occasions that have higher requirements for LCD displays; RTV-1 is moisture curing type, it is required to be used up once after opening the package, otherwise it is easy to absorb moisture and thicken or even be scrapped, which brings great inconvenience to the on-site production organization

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