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Method for coating copper on surface of iron powder

A technology of surface coating and iron powder, applied in the field of chemical displacement copper plating method to coat a layer of copper, and the surface of iron powder to coat copper, which can solve the problem of uneven copper coating, easy falling off and easy agglomeration of copper coating Agglomeration and other problems, to achieve the effect of controllable copper layer thickness, preventing copper layer oxidation and particle agglomeration

Inactive Publication Date: 2011-05-11
SHANDONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Coating iron powder with copper is one of the effective methods to improve the corrosion resistance of iron powder. The disadvantage of the traditional electroless copper plating method for coating iron powder is that the solution has poor stability and is prone to self-catalytic decomposition.
Application number is that the Chinese patent of 95116704.9 has introduced a kind of iron-based displacement method copper plating plating agent, and the deficiency of this patent is: 1) there is obvious hydrogen evolution phenomenon in the plating process, and the bonding strength of copper layer and iron powder is low, and copper clad The coating is easy to fall off; 2) The content of thiourea is high, and a layer of white substance adheres to the surface of the copper layer. When the iron powder is too fine, it is easy to agglomerate and agglomerate, thereby affecting the cleaning, subsequent processing and application performance of the copper-clad iron powder; 3 ) For ultra-fine iron powder, the reaction is not easy to control, the solution composition changes greatly and the copper coating layer is uneven

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0010] Replacement copper plating solution composition: copper phytate 7g / L, sulfuric acid (98%) 20g / L, composite additive 3.0g / L; The composition (quality) of composite additive: thiourea 5%, propenylthiourea 5%, benzene Triazole 28%, 8-hydroxyquinoline 12%, sulfosalicylic acid 15%, OP emulsifier 1%, sodium dodecylbenzenesulfonate 2%, saccharin 8% and polyethylene glycol 24% ;At room temperature, adjust the stirring speed to 500rpm, add iron powder with a particle size of 20-30um, plating time is 45min, and the thickness of the copper coating layer is 0.6-0.8um; after sedimentation, separation from iron phytate precipitation, washing and drying to obtain copper-clad iron powder. The iron powder coated copper process is as follows:

[0011] Iron powderdegreasingwater washingpicklingwater washing → displacement plating → water washingprecipitation and separation of copper-clad iron powder and ferric phytate → water washing → dehydrationdrying → copper-clad ir...

Embodiment 2

[0013] Replacement copper plating solution composition: copper phytate 17g / L, sulfuric acid (98%) 60g / L, composite additive 4.5g / L, composite additive is formed with embodiment 1; At room temperature, adjust stirring speed to be 400rpm, add particle diameter It is 40-50um iron powder, the plating time is 60min, and the thickness of the copper cladding layer is 1.0-1.2um; after settling, separating from iron phytate precipitation, washing and drying, the copper-clad iron powder is obtained. The iron powder coated copper process flow is the same as in Example 1.

Embodiment 3

[0015] Replacement copper plating solution composition: copper phytate 20g / L, sulfuric acid (98%) 70g / L, composite additive 5.0g / L, composite additive is formed with embodiment 1; At room temperature, adjust stirring speed to be 300rpm, add particle diameter It is 60-80um iron powder, the plating time is 90min, and the thickness of the copper cladding layer is 1.5-1.7um; after settling, separating from iron phytate precipitation, washing and drying, the copper-coated ultrafine iron powder is obtained. The iron powder coated copper process flow is the same as in Example 1.

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PUM

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Abstract

The invention provides a method for coating copper on the surface of iron powder. The method comprise the following steps: under the conditions of room temperature and stirring, taking the iron powder as a core, coating an even, compact and high-bond strength copper layer on the surface of the iron powder by a chemical displacement coppering method, and controlling the thickness of the coppering layer through regulating the composition, acid degree, stirring rate and plating time of a solution. The displacement coppering solution comprises the following components: 7-20g / L of copper phytic acid, 20-80g / L of sulphuric acid (98%) and 3.0-5.0g / L of compound addictive; the plating process parameters are as follows: the temperature is the room temperature, the stirring speed is 30-500rpm, and the time is 10-120 minutes; and the compound addictive comprises the following components by weight: 5% of thiourea, 5% of alylthiourea, 28% of benzotriazole, 12% of 8-oxyquinoline, 15% of sulfosalicylic acid, 1% of po1yoxyethylene octylphenol ether (OP) emulsifier, 2% of sodium dodecyl benzene sulfonate, 8% of saccharin and 24% of polyethylene.

Description

technical field [0001] The invention belongs to the field of metal material processing, and in particular relates to a method for coating copper on the surface of iron powder. Specifically, a layer of copper is coated on the surface of iron powder by chemical displacement copper plating to improve the processing performance and application of iron powder. performance. Background technique [0002] As an important industrial raw material, iron powder is widely used in machinery, metallurgy, chemical industry and other fields. The disadvantage of iron powder is that it is not resistant to corrosion. Coating iron powder with copper is one of the effective methods to improve the corrosion resistance of iron powder. The disadvantage of the traditional electroless copper plating method for coating iron powder is that the solution has poor stability and is prone to autocatalytic decomposition. Application number is that the Chinese patent of 95116704.9 has introduced a kind of iro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/38B22F1/02
Inventor 管从胜马希骋刘士明
Owner SHANDONG UNIV
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