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Cu-Sn-Ti solder and method for brazing Ti2AlC ceramics and Cu with same

A cu-sn-ti, solder technology, applied in welding media, welding equipment, welding/cutting media/materials, etc., can solve the problems of short life and high cost of current-carrying friction devices, and achieve good conductivity and high temperature. Excellent thermal stability, high conductivity connection effect

Inactive Publication Date: 2011-03-23
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a kind of Cu-Sn-Ti brazing material and its brazing Ti 2 AlC ceramics and copper methods to achieve a Ti 2 The high-strength and high-conductivity connection of AlC ceramics and copper solves the problems of high cost and short life of current-carrying friction devices in existing engineering applications

Method used

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  • Cu-Sn-Ti solder and method for brazing Ti2AlC ceramics and Cu with same
  • Cu-Sn-Ti solder and method for brazing Ti2AlC ceramics and Cu with same
  • Cu-Sn-Ti solder and method for brazing Ti2AlC ceramics and Cu with same

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specific Embodiment approach 1

[0016] Specific embodiment 1: The Cu-Sn-Ti solder of this embodiment is made of 70% to 80% of Cu powder, 10% to 20% of Sn powder and 10% of TiH by mole percentage. 2 The powder is prepared by mechanical alloying.

[0017] The specific operation method of mechanical alloying described in this embodiment is: weighing 70% to 80% of Cu powder, 10% to 20% of Sn powder and 10% of TiH by mole percentage 2 Powder, then Cu powder, Sn powder and TiH 2 Put the mixed powder of the powder into the Al attached to the QM-3SP04 planetary ball mill 2 O 3 In the ceramic tank, the ball-to-material ratio is controlled to be 5:1, the speed is 260r / min, and the mixed powder can be ball milled.

[0018] The Cu-Sn-Ti solder in this embodiment is a powder solder, which can ensure the electrical conductivity of the joint. The Cu-Sn-Ti solder is a Cu-based solder, and since one side of the base material is pure copper, a certain amount of Sn is added to the solder to reduce the melting point. However, consid...

specific Embodiment approach 2

[0020] Specific embodiment two: this embodiment is different from specific embodiment one in that the Cu-Sn-Ti solder is made of 75% Cu powder, 15% Sn powder and 10% TiH by mole percentage. 2 The powder is prepared by mechanical alloying. Other parameters are the same as in the first embodiment.

[0021] The Cu-Sn-Ti solder brazing Ti of this embodiment 2 The compressive shear strength of the joint obtained from AlC ceramic and copper reaches 40.53~187MPa, and the electrical conductivity reaches 5.130×10 6 ~5.997×10 6 S / m.

specific Embodiment approach 3

[0022] Specific embodiment three: Brazing Ti using Cu-Sn-Ti solder in this embodiment 2 The method of AlC ceramics and copper is achieved through the following steps: 1. The Ti 2 AlC ceramics are polished with 320#, 600#, 800#, 1000#, 1200# and 1600# metallographic sandpaper to a bright surface, and then the Ti is polished with a 0.5μm diamond polishing agent. 2 The surface to be connected to the AlC ceramic is polished; then the copper is polished with 1000# and 1600# metallographic sandpaper until the surface is bright, and then the surface of the copper to be connected is polished with a diamond polishing agent of type 0.5μm; Ti after treatment 2 AlC ceramics and copper are immersed in absolute ethanol, ultrasonically cleaned for 10-20 minutes, taken out, and air-dried; 3. Mixing Cu-Sn-Ti solder and hydroxyethyl cellulose binder to obtain paste-like Cu-Sn-Ti solder Material, then paste Cu-Sn-Ti solder, Ti 2 AlC ceramic and copper are assembled into Ti 2 AlC ceramic / Cu-Sn-Ti br...

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Abstract

The invention relates to a Cu-Sn-Ti solder and a method for brazing Ti2AlC ceramics and Cu with the same, relating to a Cu-Sn-based solder and a method for brazing Ti2AlC ceramics and Cu with the same and realizing the high-strength and high-conductivity connection of the Ti2AlC ceramics and the Cu. The method comprises the following steps of: respectively grinding, polishing and clearing the Ti2AlC ceramics and the Cu and assembling the Ti2AlC ceramics, the Cu-Sn-Ti solder and the Cu into a brazing assembly unit; and then, brazing in a vacuum brazing furnace. The invention successfully realizes the connection between the Ti2AlC ceramics and the Cu and reaches the joint compression shearing strength of 40.53-187 MPa, the conductivity of 5.13*106-5.997*106 S / m, high joint strength and good electrical conductivity. The Ti2AlC ceramics and Cu connector is used for a carrier friction device and can solve the problems of high cost and shorter service life existing in the carrier friction device in traditional engineering applications.

Description

Technical field [0001] The invention relates to a Cu-Sn based solder and brazing Ti with it 2 AlC ceramic and copper method. Background technique [0002] Ti 2 AlC ceramics are ternary layered ceramics M n+1 AX n One of them, it is a structure / function integrated ceramic with both metal and ceramic properties. Ti 2 The space lattice of AlC ceramics is hexagonal crystal system, and the space group is P6 3 / mmc, by Ti 6 The C octahedral layer and the two-dimensional densely packed Al atomic layer are alternately arranged. First, Ti atoms and Al atoms are combined by van der Waals force, which makes the ceramic have a layered structure and good self-lubricating properties; secondly, Ti atoms and C atoms are covalently bonded, and the Ti-C bond is firm. The combination gives the ceramics excellent physical, chemical and mechanical properties, such as high melting point, high thermal stability; good oxidation resistance; high elastic modulus and high yield strength. In addition, Al ...

Claims

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Application Information

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IPC IPC(8): B23K35/30B23K1/008B23K1/20B23K1/19
Inventor 张杰郑医
Owner HARBIN INST OF TECH
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