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Packaging material applied to light-emitting diode (LED) and preparation method and using method thereof

A technology for light-emitting diodes and packaging materials, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of infiltration, decreased LED stability, insufficient protection of LED chips, etc., and achieve the effect of no surface stickiness and good resistance to yellowing.

Active Publication Date: 2010-10-27
NICHE TECH KAISER SHANTOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, since silicone material is a typical low surface energy material, this material also has the following disadvantages for high-power LED packaging: the cured product obtained after curing cannot form effective bonding with most materials, so that it is difficult for the LED chip. Insufficient protection, the LED may be infiltrated by water vapor, oxygen, etc. due to the gap between the cured product and the sealed component during use, resulting in a decrease in the stability of the LED

Method used

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  • Packaging material applied to light-emitting diode (LED) and preparation method and using method thereof
  • Packaging material applied to light-emitting diode (LED) and preparation method and using method thereof
  • Packaging material applied to light-emitting diode (LED) and preparation method and using method thereof

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Embodiment 1

[0046] In this embodiment, the encapsulation material applied to the light-emitting diode consists of potting colloid and adhesion-promoting primer.

[0047] For the preparation method and composition of the potting colloid, please refer to the preparation method and composition of the encapsulation material in Example 1 of the Chinese invention patent application publication specification CN101508882A (application number 200910119797.6).

[0048] In the present embodiment, the preparation method of adhesion-promoting primer comprises the following steps:

[0049] (1) By weight, add 1 part of silicone resin to 100 parts of toluene, the structural formula of silicone resin is (Me 3 SiO 3 / 2 ) 62 (Me 2 SiO 0.5 ) 38 (MeViSiO 0.5 ) 6 (SiO 2 ) 29 ; Then add 1 part of butyl titanate, stir until evenly mixed and heat up to 80°C;

[0050] (2) 10 parts of ethyl orthosilicate, 2 parts of γ-methacryloxypropyltrimethoxysilane and 6 parts of methylhydrogensiloxane are added dropwi...

Embodiment 2

[0056] In this embodiment, the encapsulation material applied to the light-emitting diode consists of potting colloid and adhesion-promoting primer.

[0057] For the preparation method and composition of the potting colloid, please refer to the preparation method and composition of the encapsulation material in Example 2 of the Chinese invention patent application publication specification CN101508882A (application number is 200910119797.6).

[0058] In the present embodiment, the preparation method of adhesion-promoting primer comprises the following steps:

[0059] (1) By weight, add 10 parts of silicone resin to 100 parts of n-heptane, the structural formula of silicone resin is (Me 3 SiO 3 / 2 ) 43 (Me 2 SiO 0.5 ) 59 (MeViSiO 0.5 ) 8 (SiO 2 ) 32 ; then add 10 -5 Parts of chloroplatinic acid vinyl siloxane complex, stirred until uniformly mixed and heated to 100°C;

[0060] (2) Add 13 parts of methylhydrogensiloxane and 16 parts of vinyltrimethoxysilane dropwise to...

Embodiment 3

[0066] In this embodiment, the encapsulation material applied to the light-emitting diode consists of potting colloid and adhesion-promoting primer.

[0067] For the preparation method and composition of the potting colloid, refer to the preparation method and composition of the encapsulation material in Example 3 of the Chinese invention patent application publication specification CN101508882A (application number 200910119797.6).

[0068] In the present embodiment, the preparation method of adhesion-promoting primer comprises the following steps:

[0069] (1) By weight, add 5 parts of silicone resin to 100 parts of toluene, the structural formula of silicone resin is (MeSiO 3 / 2 ) 36 (Ph 2 SiO) 42 (Me 2 ViSiO 1 / 2 ) 8 (SiO 2 ) 25 ; Then add 0.2 parts of chloroplatinic acid isopropanol complex with a platinum content of 6000ppm, stir until uniformly mixed and heat up to 50°C;

[0070] (2) Add 8 parts of methyl hydrogen siloxane dropwise to the mixture obtained after st...

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Abstract

The invention discloses a packaging material applied to a light-emitting diode (LED), which is characterized by consisting of a pouring sealant body and a thickening primer coating, wherein the thickening primer coating comprises the following components in part by weight: 100 parts of organic solvent; 1 to 20 parts of silicon resin; 0.1 to 30 parts of silane coupling agent and reactive group-containing siloxane and 10<-5> to 4 parts of titanate or platinum complex. In the invention, a condensate obtained after the pouring sealant body is solidified can provide good mechanical protection for the LED; the thickening primer coating has high bonding strength, can enable the pouring sealant body condensate to be adhered to a bracket of the LED reliably, and makes no space between the pouring sealant body condensate and the bracket of the LED, and the adverse influence on the LED because water vapor, oxygen and the like penetrate into the LED in the using process is prevented, so that the packaging material can protect the LED adequately.

Description

technical field [0001] The invention relates to a packaging material applied to light-emitting diodes (LEDs), a preparation method of the packaging material, and a use method of the packaging material for packaging light-emitting diodes. Background technique [0002] The packaging materials of high-power light-emitting diodes (LEDs) are mainly organosilicon materials. Silicone materials have the advantages of heat resistance, weather resistance, ultraviolet light resistance, moisture resistance, etc., and their physical and chemical properties will not change after long-term use in an environment of -100 ° C to 200 ° C. It is an ideal LED packaging material. [0003] For example, Chinese Invention Patent Application Publication Specification CN101016446A (Application No. 200710027003.4) discloses a silicone electronic potting material, which is composed of vinyl-terminated polymethylphenylsiloxane, vinylmethyl silicone resin, polymethyl Hydrogen phenyl siloxane, catalyst an...

Claims

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Application Information

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IPC IPC(8): H01L33/56
Inventor 周振基周博轩郭予高
Owner NICHE TECH KAISER SHANTOU
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