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Epoxy/organosilicon/inorganic nano-hybrid material, and preparation method and application thereof

A technology of inorganic nano and hybrid materials, applied in the direction of epoxy resin coatings, applications, epoxy resin adhesives, etc., can solve the problems of difficult to obtain transparent inorganic nano-modified polymers, thermal stability, poor light resistance, and difficulties in solvent purification And other problems, to achieve high weather resistance, good heat resistance, good adhesion effect

Inactive Publication Date: 2009-09-09
FUDAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of the chemical modification method is that the process is complicated, and solvents are usually used to make purification difficult, and it is difficult to control the degree of reaction
[0003] When polymer resins are used as adhesives, optical protection materials, coating materials, etc., sometimes they need to be used under high heat and high light conditions for a long time, while polymer resins are easy to form and have good bonding performance, but poor thermal stability and light resistance , if inorganic materials are used, they have good heat resistance and light resistance, but are difficult to shape and have poor adhesion. Inorganic nano-modified polymer resins are often used to improve the above problems, but inorganic nanoparticles need to be modified by modifiers to improve Compatibility with polymers, it is difficult to obtain inorganic nano-modified polymers with good transparency and high inorganic nano content

Method used

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  • Epoxy/organosilicon/inorganic nano-hybrid material, and preparation method and application thereof
  • Epoxy/organosilicon/inorganic nano-hybrid material, and preparation method and application thereof
  • Epoxy/organosilicon/inorganic nano-hybrid material, and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] Epoxy / organosilicon / inorganic nano-hybrid material formula 1

[0052] Composition Dosage (parts)

[0053] Hydrogenated bisphenol A epoxy resin 100

[0054] Hydroxypolyphenylsilsesquioxane 70

[0055] Epoxysilane 20

[0056] Acid Nano Silica 60

[0057] In the reactor, add 50 parts of hydrogenated bisphenol A epoxy resin (EPONEX 1510), 70 parts of hydroxyl polyphenylsilsesquioxane with an average molecular weight of 5000, stir for 2 hours, add 20 parts of epoxy silane (GF-82 ), and continued to stir for 0.5 hours to obtain component A for use.

[0058] In the reactor, add 50 parts of hydrogenated bisphenol A epoxy resin (EPONEX 1510), 60 parts of acidic nano-silica, stir for 20 hours, add component A, and continue stirring for 1 hour to obtain epoxy / organic silicon / inorganic nanohybrid materials.

[0059] The epoxy / organosilicon / inorganic nano-hybrid material was heated at 150° C. for 2 hours, and cured in situ to obtain the epoxy / organic silicon / inorganic nano-hyb...

Embodiment 2

[0061] Epoxy / organosilicon / inorganic nano-hybrid material formula 2

[0062] Composition Dosage (parts)

[0063] Hydrogenated bisphenol A epoxy resin 100

[0064] Hydroxypolyphenylsilsesquioxane 2

[0065] Hydroxy silicone oil 5

[0066] Epoxysilane 2

[0067] Acidic nano aluminum oxide 15

[0068] In the reactor, add 50 parts of hydrogenated bisphenol A epoxy resin (GEST3000), 2 parts of hydroxyl polyphenylsilsesquioxane with an average molecular weight of 3500, and 5 parts of hydroxyl silicone oil with an average molecular weight of 10000, stir for 1 hour, and add 2 Part epoxy silane (GLYMO), continue to stir for 1 hour to get A component, stand-by.

[0069] In the reactor, add 50 parts of hydrogenated bisphenol A epoxy resin (GEST3000), 15 parts of acidic nano-alumina, stir for 10 hours, add component A, and continue stirring for 2 hours to obtain epoxy / organic silicon / inorganic nanohybrid materials.

[0070] The epoxy / organosilicon / inorganic nano-hybrid material was...

Embodiment 3

[0072] Epoxy / organosilicon / inorganic nano-hybrid material formulation 3

[0073] Composition Dosage (parts)

[0074] Cycloaliphatic epoxy resin 100

[0075] Hydroxy silicone oil 100

[0076] Nano aluminum dihydrogen phosphate 2

[0077] In the reactor, add 70 parts of cycloaliphatic epoxy resin (ERL-4221), 100 parts of hydroxyl silicone oil with an average molecular weight of 2000, and stir for 5 hours to obtain component A, which is ready for use.

[0078] In the reactor, add 30 parts of cycloaliphatic epoxy resin (ERL-4221), 2 parts of nano-aluminum dihydrogen phosphate, and stir for 2 hours to obtain component B.

[0079] Mix the above components A and B evenly, heat at 50°C for 5 hours, and cure in situ to obtain an epoxy / organic silicon / inorganic nano-hybrid material.

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PUM

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Abstract

The invention belongs to the technical field of chemical engineering, more specifically relates to an epoxy / organosilicon / inorganic nano-hybrid material and a preparation method thereof. The epoxy / organosilicon / inorganic nano-hybrid material is made from epoxy resin, organosilicon resin, acidic inorganic nano-particles, unnecessary organic epoxy silane, an unnecessary adjuvant and the like. The components are hybridized and cured in situ under catalytic action of the inorganic nano-particles by simple physical mixing to obtain the epoxy / organosilicon / inorganic nano-hybrid material. The production and preparation processes are environment-friendly, energy-saving, simple and easy for control, and no solvent is used in the processes. The epoxy / organosilicon / inorganic nano-hybrid material prepared by the method has the characteristics of good bonding property, high mechanical strength, high shear strength and excellent machinability of the epoxy resin, and has the characteristics of strong heat resistance, good insulatibity, strong elasticity, strong ageing resistance and good transparence of the organosilicon resin. The epoxy / organosilicon / inorganic nano-hybrid material can be taken as an adhesive, an insulating material, printing ink, a coating material, a solder mask material of a printed circuit, an optical protection material, an LED encapsulation material, an optoelectronic conversion material and the like.

Description

technical field [0001] The invention belongs to the technical field of chemical industry, and in particular relates to an epoxy / organosilicon / inorganic nano hybrid material and its preparation method and application. Background technique [0002] Silicone resin has the advantages of good thermal stability, oxidation resistance, weather resistance, low temperature performance, low surface energy, low dielectric constant, low stress, shock absorption and low noise, environmental protection and low toxicity, flame retardant or non-combustible, etc.; epoxy resin With excellent mechanical properties, electrical properties, adhesive properties, heat resistance, solvent resistance, easy molding and processing, and low cost, silicone-modified epoxy resins are often used in high-performance adhesives, coating materials, optical , Electronic protection materials, etc. However, the simple blending method is prone to phase separation and has poor mechanical properties; epoxy / silicone r...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L63/02C08L83/04C08K13/06C08K9/00C08K3/22C08K3/32C08K3/30C08K3/36C09D163/00C09J163/00C09D11/10C08J3/24C09D183/04C09J183/04H01L33/00H01L21/56C09D11/102
Inventor 游波唐勇
Owner FUDAN UNIV
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