Composite slice type inductive element and preparation method thereof

Abstract

The invention relates to a composite material chip type inductive element and the preparation method thereof. The inductive element is applicable to the extreme-high / ultra-high frequency range chip type inductive element, adopts the three-phase composite material containing hexagonal surface soft magnetic ferrite powder, metal magnetic particles and high-temperature resistant resin as the magnetic medium, and can adjust the electromagnetic property of the material based on the three-phase composite double-seepage theory; the composite material chip type inductive element comprises a flush-type helical inner electrode and a terminal electrode which is directly connected with the inner electrode, and can adopt the base metals, such as Ni and Cu to be taken as the inner electrode material, thereby greatly reducing the cost of the element; the composite material chip type inductive element is prepared by utilizing the polymer hot pressing process, thereby avoiding the difficulty of heterogeneous co-firing in the lamination co-firing technology of the traditional chip type inductive element. The element has the advantages that the weight is light, the volume is small, the magnetic screening effect is good, the requirement of the automatic solder-reflow process can be satisfied, the production process is simple, the production cycle is short, the technical parameter is easy-to-control, the production energy consumption is low, and the element is applicable to the large-scale industrialized production.

Description

technical field [0001] The invention belongs to the field of electronic components, in particular to a chip-type inductive element prepared by a hot-pressing process using a three-phase composite material as a magnetic medium and a preparation method thereof, which can be used for chip-type inductive elements in even / ultra-high frequency bands. Background technique [0002] As one of the three major passive components, inductive components are widely used in various electronic products. With the development of electronic computers and communication technologies, the operating frequency of electronic circuits is getting higher and higher, which has exceeded GHz, which requires the application frequency of corresponding electronic components to be higher than GHz. At present, NiZnCu ferrite is used as the magnetic medium for chip inductive components, but NiZnCu ferrite is limited by its cubic crystal structure, and the cut-off frequency is very low, so it cannot be used in ev...

AI Technical Summary

Problems solved by technology

Among them, the heterogeneous co-firing of ferrite and inner electrode is the key and difficult point of this process. The sintering temperature of ferrite is generally above 1100 ° C, and it needs to be sintered in an oxygen atmosphere. For components, it is necessary to use various methods to reduce the sintering temperature of the ferrite to below the melting point of the internal electrode metal, but this method can only reduce the sintering temperature of the ferrite to a limited extent, so the internal electrode material must still have a high melting point and a very high temperature. good antioxidant capacity

In order to meet the requirements of anti-oxidation and high melting point, precious metals such as Ag or Ag-Pd alloy must be selected as the internal electrode material, and the use of precious metals as internal electrodes will greatly increase the cost of the chip inductive element

At present, chip component manufacturers generally use relatively cheap Ag as the internal electrode material of the chip inductive component, but the cost of the internal electrode material still exceeds the cost of the entire chip inductive component by more than 50%

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