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Customized polishing pads for CMP and methods of fabrication and use thereof

A chemical mechanical, polishing pad technology, applied in the direction of manufacturing tools, grinding/polishing equipment, wheels with flexible working parts, etc., can solve complex and other problems

Active Publication Date: 2008-04-23
CMC MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This is further complicated by the fact that the pattern density within a single die also typically varies

Method used

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  • Customized polishing pads for CMP and methods of fabrication and use thereof
  • Customized polishing pads for CMP and methods of fabrication and use thereof
  • Customized polishing pads for CMP and methods of fabrication and use thereof

Examples

Experimental program
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preparation example Construction

[0134] The way the polymer is prepared prior to molding or casting can affect the properties of the polishing pad and its consistency. For example, there are two well-known methods of formulating polyureas and polyurethanes, known as one-step and two-step techniques. In a single-step technique, all reaction components (eg, monomers, chain extenders, crosslinkers) react together. This process is difficult to control due to factors such as varying local concentrations of reactants and non-uniform local thermal gradients, which result in widely varying polymer product properties. In the two-step technique, the isocyanate is pre-reacted with a polyamine or polyol chain extender in the first step to form a high molecular weight prepolymer. This functionalized prepolymer is then further reacted with polyamine or polyol curing agents and / or chain extenders to complete the formation of polyurea or polyurethane. This process is more controllable, but requires higher processing temper...

example 1

[0260] Example 1: Process for Forming Windowed Pads

[0261] An in situ window forming fabrication process may be used. The manufacturing process was designed such that each of the following product streams: curing agent, diol, prepolymer, and microspheres were added continuously prior to mixing or during mixing, respectively. This is shown schematically in FIG. 21 . Using this manufacturing process, each desired feedstock flow can be easily controlled to deliver the desired amount of curing agent, glycol, prepolymer, and microspheres.

[0262] While this process offers great adjustability and flexibility, one of the other goals that can be achieved using this fabrication process is the in-situ formation of windows. During the manufacturing process, each part of the mold that needs to be filled to make the pad can be traversed at a predetermined speed by the insertion nozzle. To achieve transparency in a localized area, the flow of microspheres can be shut off or reduced when...

example 2

[0264] Example 2: Properties of polishing pads with windows transparent to visible light

[0265] As an example, this recipe is specified for the manufacture of graded CMP polyurethane pads having windows measuring 0.75 by 2.25 inches for polishing wafers. Polyurethane polishing pads are produced with predetermined hardness, pore size and porosity. The durometer of the pad is from about 65D to 75D, and the pore density is about 25% to 15% of the pad material for a pore size of 35-55 μm, respectively. The durometer value of the pad is typically 45D-75D (Shore durometer scale), and in one instance preferably about 70D for windows. In order to achieve the desired objective of optical endpoint detection using commercially available CMP equipment, the pad window is preferably transparent to visible light, since visible light is used in such detection schemes. Figure 23 shows a fully transparent pad.

[0266] The properties described in Sections II-VIII of custom pads for CMP tha...

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Abstract

The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density and pattern density, equipment platform and type of slurry used. These pads can be designed with a specialized polymeric nano-structure with a long or short range order which allows for molecular level tuning achieving superior themo-mechanical characteristics. More particularly, the pads can be designed and fabricated so that there is both uniform and nonuniform spatial distribution of chemical and physical properties within the pads. In addition, these pads can be designed to tune the coefficient of friction by surface engineering, through the addition of solid lubricants, and creating low shear integral pads having multiple layers of polymeric material which form an interface parallel to the polishing surface. The pads can also have controlled porosity, embedded abrasive, novel grooves on the polishing surface, for slurry transport, which are produced in situ, and a transparent region for endpoint detection.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to US Patent Application No. 11 / 251547, filed October 14,2005. This application claims the benefit of PCT Application No. US2005 / 025330, filed July 15, 2005. This application claims priority to US Patent Application No. 11 / 060898, filed February 18,2005. This application claims priority to US Patent Application No. 60 / 654,104, filed February 18,2005. This application claims priority to US Patent Application No. 60 / 654,173, filed February 18,2005. This application claims priority to US Patent Application No. 60 / 677062, filed May 2, 2005. US Patent Application No. 11 / 251547 is a continuation-in-part of US Patent Application No. 10 / 810070, filed March 25, 2004. U.S. Patent Application No. 10 / 810070 claims priority to U.S. Provisional Application No. 60 / 457273, filed March 25, 2003, and is U.S. Patent Application No. 11 / 060898, filed February 18, 2005 and 2004 Continuation-in-Part of PCT a...

Claims

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Application Information

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IPC IPC(8): B24D18/00B24D13/14B24B37/04
CPCB24B37/24B24D18/00
Inventor P·K·罗伊M·德奥普拉S·米斯拉
Owner CMC MATERIALS INC
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