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Method for producing surface-treated silver-containing powder and silver paste using surface-treated silver-containing powder

A technology of surface treatment and manufacturing method, which is applied to the manufacture of surface-treated silver-containing powders and the field of silver pastes using surface-treated silver-containing powders, can solve the problem of inability to develop, decrease in filling degree of silver or silver compounds, and electrical conductivity. The circuit resistance is easy to change and other problems, so as to achieve the effect of improved dispersion and long storage period

Inactive Publication Date: 2007-10-31
DAINIPPON INK & CHEM INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the resistance is relatively high. In addition, there is a disadvantage that the aggregation force of the cured resin changes due to temperature changes, so the resistance of a conductive circuit formed using a polymer-type conductive paste tends to fluctuate accordingly.
When the coating film formed on the surface of silver and silver compound particles is too thick, it is difficult to fuse and bond between adjacent particles, and the filling degree of silver or silver compound is also reduced. The original advantages of these low-temperature firing silver pastes of electrical conductivity

Method used

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  • Method for producing surface-treated silver-containing powder and silver paste using surface-treated silver-containing powder
  • Method for producing surface-treated silver-containing powder and silver paste using surface-treated silver-containing powder
  • Method for producing surface-treated silver-containing powder and silver paste using surface-treated silver-containing powder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0143] 50 g of silver powder FHD (crystallite diameter < 10 nm) manufactured by Mitsui Kinzoku Co., Ltd. with a central particle diameter of 0.3 μm, 2.5 g of a 10% by mass aqueous solution of surfactant A as a surfactant, 50 g of water as a solvent, and 400 g of zirconia beads with a diameter of 2 mm were mixed in a 250 cc plastic bottle, and kneaded for 4 hours using a rotary machine (ball mill) to obtain a silver powder dispersion (a1).

[0144] 100 g of the dispersion (a1) of the silver powder was put into a flat plate having a size of 200 mmL×150 mmW on the bottom surface, and after pre-freeze-drying, freeze-drying was carried out. As the freeze vacuum dryer, "DFM-05AS" manufactured by Nippon Vacuum Co., Ltd. was used. Place the pre-frozen silver powder dispersion (a1) on a shelf pre-cooled to about -40°C, freeze and vacuum-dry it at a vacuum degree of 7-10 Pa for 20 hours, and obtain a loose spongy dried product. The surface treatment of silver powder Object (b1) 50g. T...

Embodiment 2

[0147] Except having replaced the surfactant in Example 1 with surfactant B, 105 g of dispersion liquid (a2) of silver powder and 50 g of surface-treated matter (b2) of silver powder were obtained by the method similar to Example 1. The average volume particle size of this surface-treated product was 0.6 μm, showing the same particle size distribution as in Example 1.

[0148] Next, 58.3 g of silver paste B-2 was obtained similarly to Example 1. This silver paste is stable without causing a rise in viscosity or aggregation over time. Screen printing was performed using a mask in which a printed pattern of a 50 μm line width conductive circuit was formed, and a printed coating film was obtained in the same manner as in Example 1. Carry out full-pattern printing with a film thickness of 50 μm in the same manner as in Example 1, and measure the volume resistance after drying and putting it in a furnace at 160° C. and 250° C. for 60 minutes. The results are shown as 1.7E-02 Ω cm ...

Embodiment 3

[0150] Except that the silver powder FHD in Example 2 was replaced by the silver powder Ag C-G manufactured by Fukuda Metal Foil Powder Co., Ltd., 105 g of the dispersion liquid (a3) ​​of the silver powder and the surface-treated product of the silver powder were obtained by the same method as in Example 2. (b3) 50g. The volume average particle diameter of the silver particles at this time was 0.2 μm, showing a particle size distribution with a narrow distribution width.

[0151] Next, 58.3 g of silver paste B-3 was obtained by the method similar to Example 1. This silver paste is stable without causing a rise in viscosity or aggregation over time. Using the mask in which the printing pattern was formed similarly to Example 1, screen printing was performed, and the printing coating film was obtained. Carry out full-pattern printing with a film thickness of 50 μm in the same manner as in Example 1, and measure the volume resistance after being dried and placed in a furnace at...

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Abstract

Disclosed is a method for producing a surface-treated silver-containing powder wherein a dispersion liquid, which is obtained by dispersing silver or silver compound particles (a) in a solvent together with a surfactant (b) of alkylamine type, alkylamine salt type or phosphate type having a phosphorus content of 0.5-10% by mass, is subjected to vacuum freeze drying for having the surfactant (b) adsorbed on the surfaces of the silver or silver compound particles (a), thereby producing a silver-containing powder (c) whose surface is treated with the surfactant (b). Also disclosed is a silver paste produced by dispersing the surface-treated silver-containing powder (c) in a solvent or in a solvent and a resin.

Description

technical field [0001] The present invention relates to a method for producing a surface-treated silver-containing powder used in a silver paste excellent in conductivity and printing accuracy that can be used in printed circuits used in electronic devices and the like. More specifically, it relates to a silver paste containing a surface-treated silver-containing powder as a conductive powder component. [0002] In addition, in the present invention, "surface-treated silver-containing powder" means to include "surface-treated silver powder" and "surface-treated silver compound powder". Background technique [0003] The conductive paste is a paste containing conductive fine particles in the solid content, and metals such as gold, platinum, silver, and palladium that are not oxidized in air are generally used as conductive particles. Conventionally, conductive pastes have been broadly classified into: (1) high-temperature fired conductive pastes, which can achieve good electr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/02H01B1/22B22F1/00
Inventor 末永涉中谷洋二
Owner DAINIPPON INK & CHEM INC
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