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Sealing material composition and sealing material

A technology of sealing materials and compositions, applied in adhesive types, electrical components, semiconductor devices, etc., can solve problems such as contamination operability, foreign matter attachment, etc., and achieve excellent shape setting and excellent uneven followability

Inactive Publication Date: 2019-01-04
SEKISUI POLYMATECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This type of sealing material that solidifies the liquid is liquid, so it is easy to flow into the gap of the electronic component, and has the advantage of being able to reliably cover the electronic component. On the other hand, because it is easy to flow out from the desired range, there is a problem. The problem that the part to be exposed will also be covered
In addition, the liquid sealing material composition has problems such as easy adhesion of foreign matter before curing, or contamination of other parts after adhesion, and poor operability.

Method used

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  • Sealing material composition and sealing material
  • Sealing material composition and sealing material

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0037]

[0038] The present invention will be described in more detail based on the embodiments. The sealing material composition of the present invention is pasted and pressure-bonded on an electronic substrate on which electronic components are arranged, covers the electronic components and closely adheres thereto, and then irradiates light to cure to form a sealing material, thereby improving the bonding property to the electronic components , can protect electronic components from the intrusion of moisture or foreign matter, etc.

[0039] The sealing material composition contains a cured epoxy resin having a soft skeleton, a monofunctional (meth)acrylate monomer, a photoradical polymerization initiator, and a styrene-based elastomer as essential components. Hereinafter, these essential components of the sealing material composition will be described.

[0040] Cured Epoxy Resin

[0041] In the sealing material composition, the epoxy resin exists as a cured product obtai...

no. 2 Embodiment approach

[0092]

[0093] The sealing material composition of the second embodiment further includes hydrophobicity enhancing powder in the sealing material composition described in the first embodiment. Components other than the hydrophobicity-enhancing powder are the same as those described in the first embodiment, and thus description thereof will be omitted.

[0094] Hydrophobic Enhanced Powder

[0095] The hydrophobicity enhancing powder is a component added to improve the handleability of the sealing material composition. It is preferable to add 5 to 50 parts by mass of the hydrophobicity enhancing powder with respect to 100 parts by mass of the epoxy resin, since the handleability of the sealing material composition can be greatly improved. When it is less than 5 parts by mass, the handleability improvement effect is small. On the other hand, when it is added in excess of 50 parts by mass, the permeability to ultraviolet rays is impaired, and the sealing material composition b...

Embodiment

[0109] Hereinafter, the present invention will be described in more detail based on experimental examples.

[0110] The following sealing material compositions and sealing materials of Samples 1 to 16 were produced.

[0111]

[0112] Sample 1

[0113] The main ingredient of the mixed epoxy resin is a bifunctional epoxy resin compound having a soft skeleton, two epoxy groups in the molecule, and polyalkylene oxide as a soft skeleton added to bisphenol A (manufactured by ADEKA Co., Ltd. EP-4000S", hereinafter referred to as "main ingredient 1") 72 parts by mass, polyamine as a curing agent for epoxy resin ("EH-4357S" manufactured by ADEKA Co., Ltd.) 28 parts by mass, 52.5 parts by mass of lauryl acrylate monomer, 52.5 parts by mass of isobornyl acrylate as monofunctional alicyclic (meth)acrylate monomer, 45 parts by mass of styrene-based elastomer, A uniform liquid composition was obtained with 5.3 parts by mass of 2-hydroxy-2-methyl-1-phenylpropan-1-one as a photoradical po...

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Abstract

To provide a sealing material for affixing to an electronic element provided to an electronic substrate or the like or a portion where metal is exposed and protecting the electronic element or other adherend from moisture and the like, and an uncured sealing material composition for the same, the sealing material and the sealing material composition having fixed-shape properties, flexibility, andadhesive properties. The present invention is a sealing material composition having as essential components an epoxy resin cured material having a flexible skeleton, a monofunctional (meth)acrylate ester monomer, a photoradical polymerization initiator, and a styrene-based elastomer, the monofunctional (meth)acrylate ester monomer being curable by photoirradiation, and the sealing material composition having fixed-shape properties and flexibility whereby the load is 0.19-3.2 N when a 1-mm thickness thereof is 25% compressed by a columnar probe in which the distal end thereof forms a bottom surface having a diameter of 10 mm. The present invention is also a sealing material obtained by photocuring the sealing material composition.

Description

technical field [0001] The present invention relates to a sealing material for affixing electronic components or exposed metal parts on electronic substrates, etc., to protect adherends such as electronic components from intrusion of moisture or foreign matter, and sealing before forming the sealing material material composition. Background technique [0002] Conventionally, a sealing material using an epoxy resin as a raw material is known. This sealing material is used for covering and protecting electronic components and the like by coating and curing a liquid sealing material composition before the epoxy resin is cured on a substrate or the like. This type of sealing material that solidifies the liquid is liquid, so it is easy to flow into the gap of the electronic component, and has the advantage of being able to reliably cover the electronic component. On the other hand, because it is easy to flow out from the desired range, there is a problem. The problem that the p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08F2/44C08L25/04H01L23/29H01L23/31H05K3/28
CPCC08F2/48C08F283/10C08F287/00C08L2203/20C08L2205/05C09J163/00H01L23/293H01L23/3135H01L23/562C08L9/06C08L33/06C08L83/04C08L63/00C08F220/1811C08F220/1812C08F212/08C08F20/20C08F220/18C08F291/10C08G59/28C08G59/50C08L53/02H01L23/295H05K1/0326H05K3/28C08F2/46H01L23/29H01L23/31
Inventor 爱澤眸
Owner SEKISUI POLYMATECH CO LTD
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