Plane capacitance resonator and its making method
A technology of resonators and capacitors, which is applied in the field of planar capacitor resonators and its preparation, can solve the limitation of resonance loss on the Q value of flexible nanomechanical resonators, the reduction of the detection sensitivity of cantilever beam sensors, the limitation of preparation process and preparation cost, and is widely used etc. to achieve the effects of reducing equivalent motion impedance, improving detection sensitivity, and improving signal-to-noise ratio
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[0050] Figure 5 It is a flow chart for the preparation of the resonator of the present invention, and the specific steps are as follows:
[0051] 1) Adopt SOI silicon wafer 1 as processing substrate, device layer 8 is N-type, (100) crystal plane, the thickness of device layer 8 is respectively 10 microns and 20 microns, and the thickness of middle buried oxide layer 9 is 3 microns ( Figure 5 a);
[0052] 2) On the surface of SOI silicon wafer 1 device layer 8, LPCVD (low pressure chemical vapor deposition) a layer of SiNx with a thickness of 150nm, use photoresist for the first photolithography, and dry in a reactive ion etching system (RIE) Method etching SiNx, forms SiNx insulating layer 6, and this SiNx insulating layer 6 is used for isolating polysilicon pad 13 and substrate 1 ( Figure 5 b);
[0053] 3) The second photolithography, patterning the positions of the pole plates 31, 41 and the resonator 2 of the driving electrode 3 and the sensing electrode 4, and using ...
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