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Aqueous dimer acid amide curing agent, preparation method and application thereof

A dimer acid amide and curing agent technology, used in coatings, epoxy resin coatings, etc., can solve problems such as poor hardness, and achieve the effects of mild conditions, low toxicity and simple process

Inactive Publication Date: 2010-01-13
NANJING TECH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The film made by this curing agent to cure epoxy resin has good chemical resistance and high adhesive performance, but the hardness of the film is slightly poor, and can only reach H

Method used

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  • Aqueous dimer acid amide curing agent, preparation method and application thereof
  • Aqueous dimer acid amide curing agent, preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Add 28.5g of dimer acid and 28.4g of N-ethylpiperazine into a reaction kettle equipped with a stirrer, condensation and water separation device, nitrogen protection, thermometer and heating mantle, and gradually heat up to 140°C, stirring continuously during the heating process, so that The two components are fully mixed to obtain a light yellow clear solution; the reaction temperature is controlled at 150°C, and the reaction time is slowly refluxed for 3 hours, so that the dimer acid and N-ethylpiperazine form a salt at a low temperature; when the temperature of the reactor reaches 150-170 ℃, water begins to be separated at room temperature, continue to heat up to 230 ℃, keep warm at this temperature for 2 hours until the water is basically evaporated, continue to reflux for 0.5 hours, stop heating; start vacuum distillation at low temperature, when the temperature Return to 230°C, excess N-ethylpiperazine is distilled off, stir at this temperature for 1 hour, when subs...

Embodiment 2

[0031] Add 28.5g of dimer acid and 31.0g of N-ethylpiperazine into a reaction kettle equipped with a stirrer, condensation water separator, nitrogen protection, thermometer and heating mantle, and gradually heat up to 140°C, stirring continuously during the heating process, so that The two components are fully mixed to obtain a light yellow clear solution; the reaction temperature is controlled at 150°C, and the reaction time is slowly refluxed for 4 hours, so that the dimer acid and N-ethylpiperazine form a salt at a low temperature; when the temperature of the reactor reaches 150-170 ℃, water begins to be separated at room temperature, continue to heat up to 230 ℃, keep warm at this temperature for 3 hours until the water is basically evaporated, continue to reflux for 0.5 hours, stop heating; start vacuum distillation at low temperature, when the temperature Return to 230°C, excess N-ethylpiperazine is distilled off, stir at this temperature for 1 hour, when substantially no...

Embodiment 3

[0034]Add 28.5g of dimer acid and 32.3g of N-ethylpiperazine into a reaction kettle equipped with a stirrer, condensation water separator, nitrogen protection, thermometer and heating mantle, gradually heat up to 140°C, and keep stirring during the heating process, so that The two components are fully mixed to obtain a light yellow clear solution; the reaction temperature is controlled at 150°C, and the reaction time is slowly refluxed for 3 hours, so that the dimer acid and N-ethylpiperazine form a salt at a low temperature; when the temperature of the reactor reaches 150-170 ℃, water begins to be separated at room temperature, continue to heat up to 230 ℃, keep warm at this temperature for 2 hours until the water is basically evaporated, continue to reflux for 0.5 hours, stop heating; start vacuum distillation at low temperature, when the temperature Return to 230°C, excess N-ethylpiperazine is distilled off, stir at this temperature for 1 hour, when substantially no N-ethylp...

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Abstract

The present invention discloses a waterborne dimer acid amide curing agent, a preparation method and the application thereof, the waterborne dimer acid amide curing agent can be well dispersed in the water for dissolution, the concentration of the solid is 30 to 40 percent, the amine value is higher, which can achieve more than 200mgKOH / g, furthermore, the toxicity is low, and the present invention has no pollution to the environment; at the same time, the raw materials are easy to be obtained, and the cost is low. The preparation method adopts the industrial level dimer acid and piperazine derivatives for low-temperature salification and high-temperature condensation, so as to form the polyamide curing agent, the curing agent can generate the water emulsion with the solid content of 30 to 40 percent by emulsifying under certain temperature, and then the waterborne coating can be prepared by the combination of the water emulsion and the epoxy resin water emulsion with the solid content of 50 percent.

Description

technical field [0001] The invention relates to a curing agent, a preparation method and its application, more specifically to a water-based dimer acid amide curing agent, a preparation method and its application. Background technique [0002] Polyamide is a molecule containing amide structure High polymer, polyamide has the following excellent properties: [0003] ①. It has good softness, friction resistance and creep resistance; ②Polyamide can greatly reduce the surface tension, form a molecular film along the interface, can well infiltrate the solid surface, improve the adhesion, and has excellent Water resistance and chemical resistance; ③ Polyamide with high amine value can be better dispersed and dissolved in water; ④ Polyamide is used as epoxy emulsion coating curing agent, showing excellent emulsification and film-forming ability; ⑤ Use polyamide to cure The curing shrinkage rate of the epoxy resin is small, less than 0.03%, the cured product has good dimensional ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G69/26C09D7/12C09D163/00
Inventor 姚成王小娟
Owner NANJING TECH UNIV
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