Manufacturing method of semiconductor device and semiconductor device

Abstract

In a dividing method according to the present invention, a wiring board formed of ceramic is forced up (upper swing) by a lower clamp claw of a clamper, and some of a protruded wiring board portion protruding from a conveying chute is pressed against a support body to perform a first division under bending stress. Thereafter, the upward-located clamper is rotatably swung (lower swing) downward to allow an upper clamp claw to press down the protruded wiring board portion, thereby performing a reverse division at the first division section again as a second division. Since the second division allows a tensile force to act on a remaining and thin non-divided resin portion, the non-divided resin portion is torn off. Thus, the perfect division is enabled. Fractionalizing is done by a one-row division and an individual division so that each semiconductor device is formed.

Description

CROSS-REFERENCE TO RELATED APPLICATION [0001] The present application claims priority from Japanese patent application No. 2003-367435 filed on Oct. 28, 2003, the content of which is hereby incorporated by reference into this application. BACKGROUND OF THE INVENTION [0002] The present invention relates to a method of manufacturing a semiconductor device such as a hybrid integrated circuit device (hybrid IC) and a semiconductor manufacturing apparatus, and to, for example, a technique effective if applied to the manufacture of a semiconductor device built in a cellular phone. [0003] As one manufacturing method of a semiconductor device such as a hybrid integrated circuit device, there is known, for example, a technique for mounting a bare chip and other parts over unit sections of a package base substrate, which can be taken or picked up in multi form, thereafter sealing the bare chip and other parts with an insulating resin to form a sealing resin and then cutting the package base s...

AI Technical Summary

Benefits of technology

"The present invention provides a method of manufacturing a semiconductor device using a silicone resin or low elastic epoxy resin as an encapsulating material, which is capable of reliably performing division in a way that a non-divided resin portion does not remain. The method includes preparing a wiring board with device mounting sections and conductor layers in a plurality of areas of a first surface and external electrode terminals in a second surface opposite to the first surface, covering the plurality of areas with an insulating resin to form a resin layer, and preparing a division mechanism. The method also includes dividing the wiring board at a primary manufacturing stage by using a silicone resin or low elastic epoxy resin as the encapsulating material, and then performing a secondary division process to further divide the wiring board. The use of a silicone resin or low elastic epoxy resin as the encapsulating material helps prevent shorts caused by solder remelt during reflow. The method and apparatus described in this patent text can improve the manufacturing process of semiconductor devices."

Problems solved by technology

The patent document 1 has pointed out that a problem arises in that when the sealing resin is formed by a potting method, the surface of the sealing resin is hard to be flattened, and when a semiconductor device manufactured as a result thereof is surface-mounted to a circuit substrate, sorbability based on a vacuum adsorption nozzle is degraded.

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