Printing method and printing device

Abstract

Provided is a printing method which can form a uniform ink coating surface with stable coating properties, on the surface of a silicone blanket, prevent an ink from piling by improving transferability, and further, meet the requirements of an oversized printable object, and a printing device to be used for this printing method. In this printing method, the ink is applied by a slit die coater so as to allow forming of a coating surface of the ink on the surface of a silicone blanket, then a drying gas is blown to the coating surface of the ink from a gas nozzle and a solvent contained in the ink is sucked by a suction nozzle. After that, the coating surface of the ink is removed partially by rolling the silicone blanket over an indented plate, and the coating surface of the residual ink is transferred to the surface of a substrate.

Description

technical field [0001] The present invention relates to a printing method and a printing device, and more specifically, to an offset printing method based on reverse printing and a printing device used in the method. Background technique [0002] As an offset printing method based on reverse printing, there has been proposed an image forming method consisting of the following steps: a coating step of applying ink to the entire surface of a silicon wafer to form a coated surface; Relief plate formed in a predetermined shape, and transfer to the convex part of the relief plate to remove the ink removal process; Transfer process of transferring ink remaining on the coated surface to the base plate. By this method, proposals have been made to eliminate moire, eliminate pockmarks, improve resolution, flatness, and eliminate ghosting (for example, refer to JP-A-11-58921.). [0003] However, in the above-mentioned method, at first, ink needs to be coated on the entire surface of t...

AI Technical Summary

Problems solved by technology

In the case of printing at a size greater than G6, since it takes about 20 seconds from the ink coating on the surface of the silicon wafer to the end of the coating, for example, the relief plate should be placed on the ink coating surface When the ink is transferred and removed by pressing, the ink at the beginning of application has been fully dried, but the ink at the end of application has not yet been fully dried. Therefore, the release of the ink at the beginning of application on the convex part of the relief plate is good, On the other hand, the ink at the end of the application is cut off, and the mold release becomes poor.

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