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Nanometer SiO2 modifying process of ultraviolet ray cured adhesive

An adhesive and ultraviolet light technology, applied in the directions of non-polymer adhesive additives, adhesive additives, dyed silicone compounds, etc. The effect of improving performance and promoting dispersibility

Inactive Publication Date: 2007-01-03
ZHEJIANG UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Traditionally used in nano-SiO 2 Modified silane coupling agents are mainly vinyltriethoxysilane, γ-methacryloxypropyltrimethoxysilane, aminopropyltriethoxysilane, etc. These coupling agents are useful for improving nano-SiO 2 The lipophilicity of the surface promotes nano-SiO 2 Basic compatibility with organic solvents and polymers, reducing SiO 2 Agglomeration has a certain effect, but the above-mentioned coupling agent, due to its short molecular chain, cannot 2 Particles are effectively packaged, so nano-SiO 2 Particles in the organic matrix, especially in organic solvents and UV-curable adhesive matrix resins such as urethane acrylate and epoxy acrylate, still have partial agglomeration, and cannot be well dispersed, which affects its UV curing. Application performance in adhesives; the bonding performance of adhesive products obtained by applying the method of the present invention on glass and metal series materials is greatly improved

Method used

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  • Nanometer SiO2 modifying process of ultraviolet ray cured adhesive
  • Nanometer SiO2 modifying process of ultraviolet ray cured adhesive
  • Nanometer SiO2 modifying process of ultraviolet ray cured adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Add 2.5% Si-1, 15% urethane acrylate, and 87.5% acetone to the glass container respectively. After blending, ultrasonically disperse for 15 minutes, stir and heat at 60°C for 6 hours to promote SiO 2 Dispersion of particles in urethane acrylate, and then distill off the acetone and isopropanol solvents under reduced pressure; then the obtained SiO 2 / Urethane acrylate composite prepolymer by 60%, hydroxypropyl methacrylate 20%, trimethylolpropane (3 ethoxylated) triacrylate 5%, acid functional group acrylate 10%, 1173 photoinitiated 2%, KH570 1%, triethanolamine 1.5%, maleic acid 0.5% mass ratio mixed together, the sample obtained by stirring evenly is colorless and transparent; the sample is placed under a 300W ultraviolet lamp at 8cm within 5 seconds Can be fully cured; SiO in the sample after curing 2 The schematic diagram of particle dispersion is shown in Figure 5 , and other performance test results are shown in Table 1.

Embodiment 2

[0036] Add 2.5% Si-2, 15% urethane acrylate, and 87.5% acetone to the glass container respectively. After blending, ultrasonically disperse for 15 minutes, stir and heat at 60°C for 6 hours to promote SiO 2 Dispersion of particles in urethane acrylate, after the reaction, acetone and isopropanol solvents were evaporated under reduced pressure; then the obtained 40% SiO 2 / Urethane Acrylate Composite Prepolymer Press 40%, Epoxy Acrylate 20%, Hydroxypropyl Methacrylate 20%, Trimethylolpropane (3 Ethoxylated) Triacrylate 5%, Acid Functional Acrylic 10% of ester, 2.5% of 1173 photoinitiator, 1% of KH570, 1.0% of triethanolamine and 0.5% of maleic acid are mixed together, and the sample obtained by stirring evenly is colorless and transparent; the sample is placed in a 300W ultraviolet lamp It can be completely cured within 5 seconds at the lower 8cm; other performance test results are shown in Table 1.

Embodiment 3

[0038] Add 2.5% Si-3, 15% epoxy acrylate, and 87.5% acetone to the glass container respectively. After blending, ultrasonically disperse for 30 minutes, stir and heat at 60°C for 4 hours to promote SiO 2 After the dispersion of particles in epoxy acrylate, after the end, the acetone and isopropanol solvents were evaporated under reduced pressure; then the obtained SiO 2 / Epoxy acrylate composite prepolymer by 80%, 10% of hydroxypropyl methacrylate, 5% of trimethylolpropane (3 ethoxylated) triacrylate, 2.5% of 1173 photoinitiator, KH570 is 1 %, triethanolamine 1.0%, and maleic acid 0.5% by mass, and the sample obtained by stirring evenly is colorless and transparent; the sample can be completely cured within 5 seconds at 8cm under a 300W ultraviolet lamp; other performance tests The results are shown in Table 1.

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Abstract

The present invention discloses nanometer SiO2 modifying process of UV ray cured adhesive. The long chain polyether silane coupler in the general expression of (R1O)3SiCH2CH2CH2O(CH2CH2O)a(CH2CH(CH3)O)bC=OC(R2)=CH2 is first used in surface modifying SiO2 of grain size of 5-50 nm inside isopropyl alcohol dispersing medium; the obtained composite pre-polymer is then mixed with epoxy acrylate, hydroxyethyl methacrylate or hydroxypropyl methacrylate, trimethylopropane-3ethoxyl -triacrylic ester, acrylic cid or acrylate with acid functional radical, photoiniitator, KH570, triethanolamine and maleic acid through stirring to obtain the UV adhesive product. The present invention has improved SiO2 dispersivity and stability, and the UV adhesive product has greatly raised adhesion performance.

Description

technical field [0001] The invention relates to the field of research and development of fine chemical products, in particular, the invention relates to a long-chain polyether type silane coupling agent modified nano-SiO 2 (silicon dioxide) method. Background technique [0002] Ultraviolet (UV) curing technology is a new green technology developed since the 1960s. It refers to the process of polymerization, crosslinking and curing of liquid phase systems in an instant after ultraviolet radiation. Its unique advantages: (1) fast curing; it can be cured into a hard, wear-resistant and beautiful cured coating film in a few seconds or even less than a second, with excellent product performance; (2) energy saving and time saving; no additional drying is required Equipment, suitable for continuous production, can greatly improve production efficiency; (3) low or no solvent release; (4) small equipment size, low investment; (5) low curing temperature and fast curing speed. [000...

Claims

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Application Information

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IPC IPC(8): C09C1/28C09C3/12C09J11/04
Inventor 范宏李伯耿谭军郑志鹏刘万章
Owner ZHEJIANG UNIV
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