Solder resist composition of light-curing single liquid style and printing circuit board use same
A printed circuit board, photocurable technology, used in printed circuits, printed circuit manufacturing, photosensitive materials for opto-mechanical equipment, etc. Electrolytic tin plating is resistant to plating, has not yet reached practical use, etc., and achieves high reliability.
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[0039] The following examples and comparative examples are given to describe the present invention in detail, but the present invention is not limited to the following examples. In addition, the following so-called "parts" mean "parts by weight" unless otherwise specified.
Synthetic example 1
[0041] In a flask equipped with a thermometer, a stirrer, a dropping funnel and a reflux condenser, 300.0 g of dipropylene glycol monomethyl ether as a solvent was heated to 100°C, and 172.0 g of methacrylic acid, 172.0 g of methacrylic acid and 172.0 g of methacrylic acid were added dropwise over 3 hours. A mixture of ε-caprolactone-modified methacrylic acid (average molecular weight 344), 150.0 g of methyl methacrylate, 142.0 g of dipropylene glycol monomethyl ether, and 10.0 g of azobisisobutyronitrile as a polymerization catalyst, Then, it was stirred at 110° C. for 3 hours to deactivate the polymerization catalyst to prepare a copolymer resin solution. After cooling the resin solution, 170.0 g of 3,4-epoxycyclohexyl methacrylate (Saicroma-A400 from Daisel Chemical Co., Ltd.), 3.0 g of triphenylphosphine, and 1.3 g of hydroquinone monomethyl were added. base ether, the temperature was raised to 100°C, and the ring-opening addition reaction of epoxy was carried out with sti...
Synthetic example 2
[0043]In a flask equipped with a thermometer, a stirrer, a dropping funnel, and a reflux condenser, 276.0 g of dipropylene glycol monomethyl ether as a solvent and 8.0 g of azobisisobutyronitrile as a polymerization catalyst were added. Under a nitrogen atmosphere, it was heated to 80°C, and the monomers of 172.0 g of methacrylic acid, 100.0 g of methyl methacrylate, and 114.0 g of ethyl methacrylate were added dropwise and mixed for about 3 hours. After stirring for 1 hour, the temperature was raised to At 115°C, the polymerization catalyst was deactivated to obtain a copolymer resin solution.
[0044] After the resin solution was cooled to 85-95°C, 0.3 g of methylhydroquinone as a polymerization inhibitor and 2.0 g of triphenylphosphine as a catalyst were added, 160.0 g of glycerol methacrylate was slowly added dropwise, and the reaction was carried out for about 24 hours . The thus obtained co-clustered resin having two or more (meth)acryloyl groups and carboxyl groups in ...
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