Radiator with uniform temperature hot cavity

Abstract

A heat dissipation device for a heat generating electronic package is composed of a heat radiator and a temp homogenizing cavity consisting of capillary structure for returning the working fluid back to heat absorbing region, heat absorbing region in contact with electronic package, heat dissipating region in contact with heat radiator, working fluid for transferring heat, and at least one buffer region able to provide a fluid storage space.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device with a cavity with good heat transfer and heat uniform temperature. Background technique [0002] With the advancement of technology, the number of transistors per unit area of ​​electronic components is increasing, resulting in an increase in heat generation during operation. On the other hand, the operating frequency of electronic components is getting higher and higher, and the heat (switch loss) caused by on / off switching when the transistor is working is also the reason for the increase in the heat generation of electronic components. In recent years, due to the rapid development of semiconductor technology and IC manufacturing technology, the calculation speed of the chip has been greatly improved. Relatively, when the chip is working, the heat consumption increases with the increase of the clock frequency. If it is not properly processed The heat will...

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Problems solved by technology

Therefore, in order to quickly export heat energy, the thickness of the capillary structure is reduced. However, although this method can increase the conduction speed, when the heat source generates a large amount of heat, the working fluid evaporates quickly, and the working fluid does not have time to replenish and the heating point becomes dry. (dry out), damage plate heat pipe 13

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