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Temperature measurement component, temperature measurement device and electric appliance component

A technology of temperature measurement and components, which is applied in the direction of measuring devices, measuring heat, and parts of thermometers, etc., can solve the problems of electronic devices and related equipment not working properly, so as to avoid excessive glue filling time, high general performance, Apply the effect of high efficiency

Pending Publication Date: 2018-01-19
TYCO ELECTRONICS (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Especially when a large current passes through the electronic device, the resulting excessive temperature may often cause the electronic device and its related equipment to malfunction

Method used

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  • Temperature measurement component, temperature measurement device and electric appliance component
  • Temperature measurement component, temperature measurement device and electric appliance component
  • Temperature measurement component, temperature measurement device and electric appliance component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] see figure 1 and figure 2 , which is a temperature measurement component 101 provided by the present invention. The temperature measuring component 101 includes a thermal pad 10 and a temperature measuring element 20 . The temperature measuring element 20 is arranged in contact with the heat conduction pad 10 . The heat conduction pad 10 is used for heat conduction connection with the object 88 to be measured below. It is conceivable that the heat conduction pad 10 can be made of any heat conduction material. In order to take into account good elastic deformation capability, insulation performance and thermal conductivity, in this embodiment, the heat conduction pad 10 is an integral piece of silicone. Certainly, the silica gel integrated part may include some specific heat-conducting materials, such as ceramic powder.

[0062] Please also refer to image 3 , which is a schematic diagram of the structure of the thermal pad 10 when no deformation occurs, that is, ...

Embodiment 2

[0065] see Figure 4 to Figure 7 , the present invention also provides a temperature measuring device 102 . The temperature measuring device 102 includes a terminal connector 30 and the aforementioned temperature measuring component 101 . The terminal connector 30 is arranged in contact with the temperature measuring element 20 .

[0066] The terminal connector 30 includes a mounting seat 31 and a connecting terminal 35 . During installation, the mounting base 31 drives the temperature measuring element 20 to move to contact with the object 88 to be measured. Meanwhile, the mounting seat 31 is used to carry the connection terminal 35 . In this embodiment, in order to cooperate with the mating connector 60 and the installation housing 40 described below, the installation seat 31 includes a seat main body 311 and a protruding portion 315 .

[0067] The seat main body 311 is used for carrying the connecting terminal 35 and the protruding portion 315 . In this embodiment, the...

Embodiment 3

[0071] As another implementation of the second embodiment, please refer to Figure 8 and Figure 9 , which is a schematic structural diagram of a temperature measuring device 103 provided by the present invention. Different from the second embodiment, the temperature measurement device 103 further includes an installation housing 40 . The installation shell 40 is arranged on the object 88 to be measured. The temperature measurement assembly 101 is disposed on the installation housing 40 .

[0072] Please also refer to Figure 10 , the installation housing 40 is used to carry the temperature measurement assembly 101 . In this embodiment, in order to achieve a stable bearing, the installation shell 40 has a shell recess 41 . The housing recess 41 is recessed from the upper surface of the installation housing 41 to the lower surface. The bottom of the housing recess 41 is in contact with the temperature-measuring object 88 . A connection through hole 42 is opened at the bo...

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PUM

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Abstract

The invention discloses a temperature measurement component, a temperature measurement device and an electric appliance component. The temperature measurement component comprises a heat conduction padand a temperature measuring element. The heat conduction pad is in thermally conductive connection with an object to be measured in temperature. The temperature measuring element is in contact with the heat conduction pad, is arranged at intervals with the object to be measured in temperature, and is used for detecting the temperature of the object to be measured in temperature. The temperature measurement component replaces a heat transfer structure made by a potting and packaging process with the heat conduction pad, thereby avoiding low efficiency caused by long potting time and the inconvenient control of glue curing time. Further, the heat conduction pad does not require complicated structural cooperation and has high universal performance.

Description

technical field [0001] The invention relates to a device for measuring temperature, in particular to a temperature measuring component, a temperature measuring device and an electrical component. Background technique [0002] Due to the existence of resistance, electronic devices generate heat during operation. The excessive temperature caused by the heating of electronic devices not only affects the service life of electronic devices, but also endangers other components connected and working together. Especially when a large current passes through the electronic device, the resulting excessive temperature may often cause the electronic device and its related equipment to fail to work normally. Therefore, in the prior art, in applications of electronic devices that have high requirements on temperature range and safety performance, it is often necessary to monitor the temperature of the electronic device. Accordingly, a temperature measuring device is required to monitor t...

Claims

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Application Information

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IPC IPC(8): G01K7/22G01K1/16
CPCG01K1/14G01K1/16H01M10/486G01K2007/163H01M2220/20Y02E60/10
Inventor 孙鹏程
Owner TYCO ELECTRONICS (SHANGHAI) CO LTD
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