Composition for removing copper ions in waste liquid and application thereof

A technology of composition and copper ions, applied in the direction of water pollutants, metallurgical wastewater treatment, water/sewage multi-stage treatment, etc., can solve the problems of high use cost, high cost, cumbersome steps, etc., and achieve improved removal efficiency and effect, The effect of reducing process pressure and improving removal efficiency

Pending Publication Date: 2022-08-02
江苏和达电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the existing etching solution technology, in order to maintain the stability of etching, a large amount of organic copper ion complexing agent will be used in the etching solution, which eventually makes it difficult to remove organic matter, and the subsequent treatment process is more difficult more expensive
[0003] The prior art (CN201210141581.1) provides a method for removing copper ions in electroless plating sewage, which is processed through multiple steps such as a primary reaction tank, a primary reactor, and a primary sedimentation tank, and multiple equipment to effectively treat Copper ions, and form a stable precipitate, but, as far as the use of existing factories is concerned, the steps of the above method are more cumbersome, the equipment needs more, the use cost is higher, and it cannot be used for a long time

Method used

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  • Composition for removing copper ions in waste liquid and application thereof
  • Composition for removing copper ions in waste liquid and application thereof
  • Composition for removing copper ions in waste liquid and application thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0030] Embodiment 1 A first aspect provides a composition for removing copper ions in waste liquid. The raw material dosage of the composition is calculated as the mass percentage of the total mass of the waste liquid: 2% of ferrous ion source, 2% of alkaline hydroxide %, sulfide ion source 0.8%, sedimentation agent 0.5%.

[0031] The ferrous ion source is ferrous hydroxide, the alkaline hydroxide is a 10wt% sodium hydroxide aqueous solution, the sulfide ion source is a 35wt% sodium hydrosulfide aqueous solution, and the precipitation agent is a 2wt% PAM solution.

[0032] In this example, the sedimentation agent was purchased from the PAM sedimentation agent product sold by Gongyi Jiajie Filter Material Co., Ltd.

[0033] The second aspect of this embodiment provides a method for using the above composition. The steps include the following steps: (1) adding a ferrous ion source to the waste liquid, and stirring for 4 hours; (2) after the stirring is completed, adding alkaline...

Embodiment 2

[0037] The specific implementation of this embodiment is the same as that of Embodiment 1, except that the addition amount of the ferrous ion source is 1%.

[0038] The treated waste liquid is as follows:

[0039]

Embodiment 3

[0041] The specific implementation of this embodiment is the same as that of Embodiment 1, except that the addition amount of the ferrous ion source is 3%.

[0042]

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PUM

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Abstract

The invention relates to the field of C02F9 / 04 of IPC classification, in particular to a composition for removing copper ions in waste liquid and application of the composition. The composition comprises the following raw materials in percentage by mass based on the total mass of the waste liquid: 0.5-5% of a ferrous ion source, 0.1-10% of alkaline hydroxide, 0.2-4% of a sulfur ion source and 0.1-3% of a settling agent. The composition prepared by the invention has a good copper ion removal effect, can synergistically remove hydrogen peroxide and most organic matters in the waste liquid at the same time, is suitable for being popularized in the field of etching, and has a wide development prospect.

Description

technical field [0001] The invention relates to the field of C02F9 / 04 classified by IPC, in particular to a composition for removing copper ions in waste liquid and application thereof. Background technique [0002] Metal etching is a technology that removes surface metal by chemical reaction or physical friction of metal materials by wet etching and dry etching. It has been widely used in display panels and semiconductor industries in recent years. In the existing etching solution technology, in order to maintain the stability of the etching, a large amount of organic copper ion complexing agent will be used in the etching solution, which eventually makes it difficult to remove the organic matter, and the subsequent processing technology is more difficult cost more. [0003] The prior art (CN201210141581.1) provides a method for removing copper ions in electroless plating sewage, which can effectively process through multi-step, multi-equipment treatment such as primary re...

Claims

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Application Information

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IPC IPC(8): C02F9/04C02F101/10C02F101/20C02F101/30C02F103/16
CPCC02F9/00C02F2101/30C02F2101/10C02F2101/20C02F1/66C02F2001/007C02F1/725C02F2305/026C02F2103/16Y02P10/20
Inventor 徐帅张红伟李闯胡天齐钱铁民
Owner 江苏和达电子科技有限公司
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