SERS (Surface Enhanced Raman Scattering) virus detection chip for detecting novel coronavirus and preparation method of SERS virus detection chip
A coronavirus and chip technology, applied in the field of laser Raman spectroscopy and virus detection, can solve the problems of false negative test results, long detection time, and insufficient sensitivity of detection reagents, and achieve enhanced specificity, light weight, and good electrical insulation. Effect
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Embodiment 1
[0066] A SERS virus detection chip for detecting the new coronavirus, such as figure 1 As shown, it includes a SERS substrate, a graphene 3 arranged on the SERS substrate, and an ACE2 bioprobe 4 arranged on the graphene 3, and the SERS substrate includes Si / SiO as a base 2 Wafer 1 and metal nanostructures 2 above it.
[0067] The metal nanostructure 2 is a gold nanodisc array structure, which is made of Si. 3 N 4 The method of direct metal evaporation on the mask plate prepares periodic gold nanodiscs and nanopore materials, and the gold nanodisc array is formed by a plurality of nanocolumns perpendicular to the substrate periodically arranged, and the pore size is the same, The thickness is 45 nm or 50 nm or 55 nm and the root diameter is 45 nm or 50 nm or 55 nm.
[0068] The graphene 3 is a single-layer CVD graphene with a thickness of 0.3 nm or 0.325 nm or 0.35 nm, a length of 500 μm and a width of 500 μm.
[0069] The ACE2 bioprobe 4 is efficiently immobilized on the g...
Embodiment 2
[0071] A preparation method of a SERS virus detection chip, which is the preparation method of a SERS virus detection chip for detecting a novel coronavirus according to Embodiment 1, and the specific steps are:
[0072] (1) In Si / SiO 2 Metal nanostructures are prepared on the wafer to form a SERS substrate;
[0073] That is, the metal nanostructures are deposited on the wafer by the simple, convenient and economical mask direct metal evaporation preparation method in the physical preparation method (see image 3 ), thereby immobilizing metal nanostructures on Si / SiO cleaned for many times 2 On the wafer substrate, the specific steps are:
[0074] ①If figure 2 shown, select Si with the same diameter size and periodically arranged pore-like structure 3 N 4 Film 5 is used as a mask, which is fixed on the cleaned Si / SiO with Kapton tape with no glue residue. 2 on wafer 1;
[0075] ②If image 3 shown, the Si / SiO 2 The wafer was placed in a magnetron sputtering apparatus,...
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