Cutting fluid for thin-sheet and large-size solar-grade silicon wafer

Abstract

The invention discloses a cutting fluid for a thin-sheet and large-size solar-grade silicon wafer, and belongs to the technical field of linear cutting processing in the photovoltaic industry. The cutting fluid consists of the following components in parts by weight: 25-40 parts of a dispersing agent, 8-15 parts of a wetting agent, 8-12 parts of a stabilizing agent and the balance of pure water, the total parts of the components are 100 parts. Wherein the dispersing agent is a polyether dispersing agent with a multi-branched structure, can provide more active adsorption sites, has higher dispersion efficiency on silicon powder, and has excellent wettability; the wetting agent is dialkynyl alcohol polyether with a symmetrical structure, and the wetting performance is higher than that of common isomeric alcohol ether, and the wetting efficiency is better. Through scientific cooperation of the dispersing agent and the wetting agent, the cutting fluid has excellent dispersion, dynamic wetting, static wetting, defoaming and other properties, the yield of silicon wafers can be effectively improved, and the stability of the cutting process is kept.

Description

technical field [0001] The invention relates to the technical field of wire-cutting processing in the photovoltaic industry, in particular to a cutting fluid for thinning and thinning large-size solar-grade silicon wafers. Background technique [0002] With the rapid development of the photovoltaic industry, lean production and cost reduction have become one of the main means for photovoltaic enterprises to survive in the fierce market environment. In recent years, large size and thinning have become the two main technical directions for reducing the cost of photovoltaic silicon wafers. Among them, thinning silicon wafers can effectively reduce the amount of silicon material per unit wattage, which is an important means to reduce costs and reduce the amount of silicon material used. At the same time, the thinning of diamond wire can effectively increase the yield rate of silicon wafers and reduce the waste of silicon materials, which is another important means to reduce cost...

AI Technical Summary

Problems solved by technology

[0003] At present, the silicon wafer cutting fluids used in the market cannot well adapt to the cutting process of large-sized silicon wafers, thin slices, and thin diamond wires. The edge chipping and bright edges caused by the decrease of wetting performance on the rubber surface make it difficult for the silicon wafer yield to meet the production target demand value of the slicing enterprise

Therefore, cutting fluid has become a bottleneck restricting the development of the silicon wafer cutting industry, which restricts the development of lower cost diamond wire thinning and large-size silicon wafer thinning.

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