Heat-conducting polymer composite material and preparation method thereof

Abstract

The invention relates to a preparation method of a heat-conducting polymer composite material, which comprises the following steps: mixing a coupling agent modified inorganic filler and boron nitride nanosheets in a solvent, uniformly dispersing, adding nanofibers, uniformly dispersing, adding an adhesive and an initiator, and uniformly mixing to form a mixed solution; and carrying out electrostatic spinning and curing on the mixed solution. According to the method, the heat transmission of the heat-conducting polymer composite material can be improved, the heat-conducting property is improved, and meanwhile, the heat-conducting polymer composite material prepared by the method also has good dielectric property and electrical insulation property.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of electronic equipment, in particular to a heat-conducting polymer composite material and a preparation method thereof. Background technique [0002] With the rapid development of all kinds of electronic equipment, microelectronics technology tends to be miniaturized and multifunctional, and due to the continuous increase of its operating frequency, a large amount of heat is generated. For example, in some ultra-high performance computers, the processor module The power can reach 200W~300W. If the heat cannot be dissipated in time, or the heat is higher than the maximum temperature threshold of electronic equipment, its stability and working efficiency will be greatly reduced, which will seriously affect the reliability and service life of the equipment. Therefore, the ability to dissipate heat in a timely and efficient manner has become a key factor affecting whether the electronic devi...

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Problems solved by technology

However, if you want to achieve a satisfactory thermal conductivity effect, you need a large amount of inorganic fillers to fill, which will affect the performance of the thermal conductivity potting compound

[0007] It can be seen that it is difficult for traditional polymer-based thermal conductive materials to simultaneously achieve the purpose of simultaneously taking into account multiple properties such as thermal conductivity, dielectric properties, and insulation properties. Therefore, it is urgent to develop a new one that has good thermal conductivity. Thermally conductive polymer composite materials that do not affect the original properties of the material (such as dielectric properties, insulation properties, etc.)

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