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High-reliability chip NTC (Negative Temperature Coefficient) thermistor material as well as preparation method and application thereof

A thermistor and reliability technology, applied in the field of high-reliability chip NTC thermistor materials and their preparation, can solve problems such as poor consistency of NTC thermistors, and achieve improved oxidation resistance, high stability, and stability. high sex effect

Active Publication Date: 2022-04-26
GUANGDONG FENGHUA ADVANCED TECH HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The raw materials that can be used to produce manganese-based heat-sensitive ceramics include manganese oxide, manganese dioxide and trimanganese tetraoxide, etc., but MnO, MnO 2 In the pre-firing process and sintering process, not only the valence state will change, but also the crystal structure will change because it is not a spinel structure. Therefore, the NTC thermistor obtained by using manganese oxide and manganese dioxide as a manganese source has poor consistency.

Method used

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  • High-reliability chip NTC (Negative Temperature Coefficient) thermistor material as well as preparation method and application thereof
  • High-reliability chip NTC (Negative Temperature Coefficient) thermistor material as well as preparation method and application thereof
  • High-reliability chip NTC (Negative Temperature Coefficient) thermistor material as well as preparation method and application thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0024] An embodiment of the high-reliability chip NTC thermistor material of the present invention, the material in this embodiment, by weight percentage, includes the following components: 42.4% Mn 3 o 4 , 39.7% Co 3 o 4 , 9.6% Ni 2 o 3 , 7.8% ZnO, 0.5% La 2 o 3 .

[0025] Its preparation method is as follows:

[0026] (1) Weigh Mn according to the formula ratio 3 o 4 、Co 3 o 4 、Ni 2 o 3 , ZnO, La 2 o 3 Mix the ingredients, put the weighed mixed powder and water into the ball mill jar at a weight ratio of 1:1.5, and ball mill for 24 hours at a rate of 30 rpm;

[0027] (2) After the ball mill is cooled, transfer the ball-milled slurry to a tray and place it in an oven at 250°C for drying;

[0028] (3) The dried material is crushed and placed in the muffle furnace for pre-firing, and the dried material is crushed and placed in the muffle furnace for pre-firing, in order to improve the consistency of the high-resistance porcelain powder pre-synthesis process and ...

Embodiment 2

[0033] An embodiment of the high-reliability chip NTC thermistor material of the present invention, the material in this embodiment, by weight percentage, includes the following components: 45.3% Mn 3 o 4 , 37.7% Co 3 o 4 , 8.7% Ni 2 o 3 , 7.5% ZnO, 0.8% La 2 o 3 .

[0034] Its preparation method is as follows:

[0035] (1) Weigh Mn according to the formula ratio 3 o 4 、Co 3 o 4 、Ni 2 o 3 , ZnO, La 2 o 3 Mix the ingredients, put the weighed mixed powder and water into the ball mill jar at a weight ratio of 1:1.5, and ball mill for 24 hours at a rate of 30 rpm;

[0036] (2) After the ball mill is cooled, transfer the ball-milled slurry to a tray and place it in an oven at 250°C for drying;

[0037] (3) The dried material is crushed and placed in the muffle furnace for pre-firing, and the dried material is crushed and placed in the muffle furnace for pre-firing, in order to improve the consistency of the high-resistance porcelain powder pre-synthesis process and ...

Embodiment 3

[0042] An embodiment of the high-reliability chip NTC thermistor material of the present invention, the material in this embodiment, by weight percentage, includes the following components: 50.5% Mn 3 o 4 , 35.2% Co 3 o 4 , 8.2% Ni 2 o 3 , 5.1% ZnO, 1.0% La 2 o 3 .

[0043] Its preparation method is as follows:

[0044] (1) Weigh Mn according to the formula ratio 3 o 4 、Co 3 o 4 、Ni 2 o 3 , ZnO, La 2 o 3 Mix the ingredients, put the weighed mixed powder and water into the ball mill jar at a weight ratio of 1:1.5, and ball mill for 24 hours at a rate of 30 rpm;

[0045] (2) After the ball mill is cooled, transfer the ball-milled slurry to a tray and place it in an oven at 250°C for drying;

[0046] (3) The dried material is crushed and placed in the muffle furnace for pre-firing, and the dried material is crushed and placed in the muffle furnace for pre-firing, in order to improve the consistency of the high-resistance porcelain powder pre-synthesis process and ...

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Abstract

The invention provides a high-reliability chip NTC (Negative Temperature Coefficient) thermistor material as well as a preparation method and application thereof. According to the thermistor material, Mn3O4, Co3O4 and Ni2O3 are used as main formula materials, and ZnO and La2O3 are used as doping materials; a main formula material and a doping material are subjected to ball milling, drying, pre-sintering and ball milling and sanding again to prepare the high-performance ceramic material. The chip NTC thermistor material is prepared from the following components in percentage by weight: 40 to 60 percent of Mn3O4, 20 to 40 percent of Co3O4, 5 to 15 percent of Ni2O3, 2 to 8 percent of ZnO and 0.5 to 1.5 percent of La2O3. Manganese dioxide is replaced by manganous-manganic oxide, and compared with a previous formula, the resistance value consistency of the resistor is better, and the stability is higher. By adding trace zinc oxide and lanthanum oxide, the stability of the material is further improved, and the aging performance of the product is improved.

Description

technical field [0001] The invention relates to the technical field of electronic devices, in particular to a high-reliability chip NTC thermistor material and its preparation method and application. Background technique [0002] NTC heat-sensitive material is a heat-sensitive material with a negative temperature coefficient. Generally, the resistance value decreases exponentially with the increase of temperature. Common heat-sensitive ceramic materials are made of Mn, Fe, Co, Ni and other transition metal oxides doped with some rare earth metal oxides as raw materials, and are made through traditional semiconductor ceramic technology. Select different system materials, adjust the ratio of formula examples and preparation process (sintering atmosphere, pre-firing temperature, sintering temperature, holding time, etc.) to obtain NTC thermosensitive materials with different resistivities and B values, so as to obtain thermosensitive materials that meet different needs. Resist...

Claims

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Application Information

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IPC IPC(8): C04B35/01H01C7/04H01C17/00
CPCC04B35/01H01C7/043H01C17/00C04B2235/3263C04B2235/3277C04B2235/3279C04B2235/3284C04B2235/3227C04B2235/96
Inventor 陈志华李强宋毅华岑权进胡建兵熊灿光向湘红
Owner GUANGDONG FENGHUA ADVANCED TECH HLDG
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