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Thin film resistance heat treatment process method and manufacturing process method

A technology of thin film resistors and process methods, which is used in resistor manufacturing, resistors, and coating resistor materials, etc., can solve the problem of poor resistance change rate, large resistance deviation, product resistance to over-stress and over-electricity exposed to high temperature The problem of poor fatigue performance, etc., achieves the effect of good resistance accuracy consistency, high pass rate, and improved overcurrent resistance performance.

Active Publication Date: 2019-03-15
CHINA ZHENHUA GRP YUNKE ELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are still at least the following deficiencies: the first point: after laser trimming, the resistance value dispersion is large, which affects the resistance value pass rate of the product; the second point: the product is unstable due to the instability of the film layer , will cause a large resistance shift, a poor resistance change rate exposed to high temperature, and poor performance in high temperature environments; the third point: when the power-on transient overload is performed, due to the large stress of the film layer, plus The stress caused by laser trimming will cause some products to have poor resistance to over-electrical stress and over-electrical fatigue

Method used

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  • Thin film resistance heat treatment process method and manufacturing process method
  • Thin film resistance heat treatment process method and manufacturing process method
  • Thin film resistance heat treatment process method and manufacturing process method

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Embodiment 1

[0055] see figure 1 , an embodiment of the present invention provides a thin film resistance heat treatment process, the thin film resistance heat treatment process comprising:

[0056] Step S101: using a heat treatment box to heat the thin film resistance to a first temperature point, and maintaining the first temperature point for a preset heating time.

[0057] For example, use a heat treatment box to heat the thin film resistance to 390-450 degrees Celsius, and maintain the temperature at 390-450 degrees Celsius for 2h-7h. Of course, the first temperature point can be 390 degrees Celsius or 425 degrees Celsius or 450 degrees Celsius, and there is no limit here, as long as it is between 390 and 450 degrees Celsius, the heating time can be 2h, 4.5h or 7h, and there is no limit here , as long as it is within the range of 2h ~ 7h.

[0058] Step S102: After a preset heating time, at least one second temperature point is used to cool down the thin film resistor for a preset co...

Embodiment 2

[0071] see image 3 , the embodiment of the present invention also provides a thin film resistor manufacturing process method, the thin film resistor manufacturing process method includes:

[0072] Step S301: Prepare electrodes on a ceramic substrate by printing.

[0073] Step S302: printing an insulating barrier layer on a part of the ceramic substrate.

[0074] Step S303: Sputtering a resistive material with a certain resistivity onto the remaining exposed area of ​​the ceramic substrate by magnetron sputtering to prepare an initial thin film resistor.

[0075] Step S304: performing heat treatment on the initial thin film resistor by using the above thin film resistor heat treatment process.

[0076] Step S305: removing the insulating barrier layer.

[0077] For example, the insulating barrier layer is washed off with clean water.

[0078] Step S306: performing laser trimming on the initial thin film resistance.

[0079] Step S307: Encapsulating the initial thin film re...

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Abstract

The invention provides a thin film resistance heat treatment process method and manufacturing process method, which relate to the field of electronic components. The thin film resistance heat treatment process method and the manufacturing process method use a heat treatment box to heat the thin film resistance to a first temperature point, and maintain a preset heating time at the first temperature point; and then use at least one first temperature point after the preset heating time The two temperature points perform cooling treatment on the thin film resistance. The preset cooling time includes the same number of cooling time periods as the number of temperature points. At least one second temperature point decreases in descending order according to the order of the cooling time periods. In this way, the precision of the resistance value of the thin film resistors finally produced is better, the pass rate is higher, and the overcurrent resistance, fatigue resistance and high temperature exposure performance of the thin film resistors are improved.

Description

technical field [0001] The invention relates to the field of electronic components, in particular to a thin film resistance heat treatment process method and manufacturing process method. Background technique [0002] Thin film resistors are made by evaporating a certain resistivity material on the surface of an insulating material by a similar evaporation method. The commonly used insulating material for thin film resistors is a ceramic substrate. Thin-film resistors are commonly used in various instruments and meters, medical equipment, power supplies, power equipment, and electronic digital products. Unlike thick-film resistors, thick-film resistors generally use screen printing technology, and thin-film resistors use vacuum evaporation and magnetron sputtering. Injection and other process methods. Thick film resistors generally have poor precision, 10%, 5%, and 1% are common precisions, while thin film resistors can achieve 0.01% one-thousandth precision, 0.1% one-thous...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01C17/00H01C17/12H01C17/242H01C17/28H01C17/30
CPCH01C17/00H01C17/12H01C17/242H01C17/28H01C17/30
Inventor 芮家群罗彦军韩玉成程德雁希毅侯本昌
Owner CHINA ZHENHUA GRP YUNKE ELECTRONICS
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