A chip safety ceramic capacitor
A technology of ceramic capacitors and safety regulations, which is applied in the direction of laminated capacitors, fixed capacitor electrodes, fixed capacitor dielectrics, etc., can solve the problems of low breakdown electric field, affecting capacitor work, poor stability, etc., and achieve enhanced breakdown electric field, large current Card effect, simple structure effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0032] A chip safety ceramic capacitor of the present invention is realized in this way. A chip safety ceramic capacitor of the present invention includes a terminal electrode 1 and an MLCC2, the terminal electrode 1 is symmetrically placed at the end of the MLCC2, and the MLCC2 has a built-in multilayer inner electrode 22. , the inner electrode 22 is connected to the end electrode 1, a hollow structure is arranged in the middle of the LLCC, the inner electrode 22 is a corrugated structure, and the ceramic 20 of the MLCC2 is prepared by a casting process;
[0033] The terminal electrode 1 has a multi-layer structure, and is sequentially composed of a copper layer 13, a soft terminal layer 12, a nickel layer 11, and a tin layer 10 from the inside to the outside. The soft terminal layer 12 and the copper layer 13 are connected by an embedded structure. The outer surface of the layer 11 is provided with irregular protrusions, the protrusion height is 0.2mm, and the tin layer 10 is...
Embodiment 2
[0043] A chip safety ceramic capacitor of the present invention is realized in this way. A chip safety ceramic capacitor of the present invention includes a terminal electrode 1 and an MLCC2, the terminal electrode 1 is symmetrically placed at the end of the MLCC2, and the MLCC2 has a built-in multilayer inner electrode 22. , the inner electrode 22 is connected to the end electrode 1, a hollow structure is arranged in the middle of the LLCC, the inner electrode 22 is a corrugated structure, and the ceramic 20 of the MLCC2 is prepared by a casting process;
[0044] The terminal electrode 1 has a multi-layer structure, and is sequentially composed of a copper layer 13, a soft terminal layer 12, a nickel layer 11, and a tin layer 10 from the inside to the outside. The soft terminal layer 12 and the copper layer 13 are connected by an embedded structure. The outer surface of the layer 11 is provided with irregular protrusions, the protrusion height is 0.5mm, and the tin layer 10 is...
PUM
Property | Measurement | Unit |
---|---|---|
diameter | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com