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Three-dimensional high-thermal-conductivity white light LED and production method thereof

A high thermal conductivity, LED chip technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems that threaten the luminous efficiency and long-term reliability of white LEDs, increase the temperature of fluorescent materials, and reduce the light conversion efficiency of fluorescent materials. Improve long-term work reliability, high luminous efficiency and low cost

Active Publication Date: 2021-06-18
HUAZHONG UNIV OF SCI & TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In the above-mentioned white light LED, since the phosphor and quantum dots will produce energy loss during the light conversion process, at this time, the phosphor microparticles and quantum dot nanoparticles are equivalent to thousands of micron / nano-scale heat sources, resulting in fluorescent materials The temperature rises, and high temperature will reduce the light conversion efficiency of fluorescent materials, which will eventually threaten the luminous efficiency and long-term reliability of white LEDs
Since phosphors and quantum dots are dispersed in the polymer colloid with extremely low thermal conductivity, conventional heat dissipation methods such as air cooling and liquid cooling are difficult to solve this technical problem

Method used

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preparation example Construction

[0043] like figure 2 As shown, the embodiment of the present invention also provides a preparation method of the three-dimensional high thermal conductivity white light LED, which includes the following steps:

[0044] S1 First, according to the overall structure of the three-dimensional high thermal conductivity white light LED, assemble the substrate 101, the reflective cavity 104, the LED chip 102 and the lead parts according to the relative positions of each other;

[0045] S2 Then mix deionized water, alkyl glycosides, non-light-absorbing thermally conductive fillers, fluorescent powder, curdlan gum and gellan gum according to a preset ratio, stir and heat to obtain a volume-expanded mixed solution;

[0046] S3 Then inject the volume-expanded mixed solution into the assembled reflective cavity 104, and cool to obtain a three-dimensional high thermal conductivity skeleton. The main body of the skeleton is a non-light-absorbing heat-conducting filler and phosphor particles...

Embodiment 1

[0058] see figure 2 , the present embodiment adopts hexagonal boron nitride, the average particle size is 45 μm; the phosphor is YAG, the average particle size is 13 μm, and the emission wavelength is 538 nm; the packaging glue is silica gel; the average particle size of quantum dot nanoparticles is 13 nm, and the emission wavelength 626nm, the chemical composition is cadmium selenide, the mass concentration of the quantum dot nanoparticle solution is 10mg / ml, the LED chip is a formal structure, and the substrate is sapphire. Specifically include the following steps:

[0059]S1 Take 100ml of deionized water, add 1ml of alkyl glycoside (APG), 3g of boron nitride, 2.5g of fluorescent powder, 1g of curdlan gum, and 1g of gellan gum to obtain a mixed solution 108, and put the mixed solution 108 into a magnetic stirrer On 111, set the rotation speed at 900 revolutions per minute, and stir for 15 minutes. The curdlan gum is fully dissolved by high-speed stirring, and a large numbe...

Embodiment 2

[0065] In this embodiment, hexagonal boron nitride is used, with an average particle size of 15 μm; the phosphor is YAG, with an average particle size of 18 μm, and a light emission wavelength of 558 nm; the packaging glue is silica gel; the average particle size of quantum dot nanoparticles is 15 nm, and the light emission wavelength is 635nm, the chemical composition is perovskite, the mass concentration of the quantum dot nanoparticle solution is 15mg / ml, the LED chip is a horizontal electrode chip, and the substrate is silicon. Specifically include the following steps:

[0066] S1 Take 100ml of deionized water, add 0.5ml of alkyl glycoside (APG), 2.5g of boron nitride, 1.5g of fluorescent powder, 0.5g of curdlan gum, and 0.5g of gellan gum to obtain a mixed solution 108, and put the mixed solution 108 into Put it on the magnetic stirrer 111, set the rotation speed at 1200 rpm, and stir for 10 minutes, fully dissolve the curdlan by high-speed stirring, and introduce a large...

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Abstract

The invention belongs to the field of white light LED packaging, and particularly discloses a three-dimensional high-thermal-conductivity white light LED and a production method thereof. The three-dimensional high-thermal-conductivity white light LED comprises a substrate, a light reflection cavity, an LED chip and a three-dimensional high-thermal-conductivity fluorescent colloid. The light reflection cavity is installed on the substrate, the LED chip is located in the light reflection cavity and fixed to the surface of the substrate, and the LED chip is connected with a lead component; and the three-dimensional high-thermal-conductivity fluorescent colloid is filled in the reflection cavity and covers the LED chip, and the three-dimensional high-thermal-conductivity fluorescent colloid is composed of a three-dimensional high-thermal-conductivity framework and quantum dot colloid filled in gaps of the three-dimensional high-thermal-conductivity framework. Light energy can be smoothly emitted from the three-dimensional high-thermal-conductivity framework, the luminous efficiency of a white light LED is guaranteed, meanwhile, the working temperature of the fluorescent colloid is reduced, the long-term reliability is improved, and the LED has a wide application prospect.

Description

technical field [0001] The invention belongs to the field of white light LED packaging, and more specifically relates to a three-dimensional high thermal conductivity white light LED and a preparation method thereof. Background technique [0002] White light-emitting diode (Light Emitting Diode, LED) is a semiconductor light-emitting device based on the principle of P-N junction electroluminescence. As the fourth-generation lighting source, LED has the advantages of high electro-optical conversion efficiency, long life, energy saving and environmental protection, and compact structure. It is recognized as one of the most promising high-tech fields in the 21st century. [0003] White LEDs are usually packaged by blue LED chips and fluorescent materials. The traditional fluorescent material is mainly yellow phosphor powder. The white LED obtained by exciting the yellow phosphor powder with a blue light chip has high luminous efficiency, but due to the lack of red light, the c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/64H01L33/50H01L33/48
CPCH01L33/48H01L33/502H01L33/641H01L33/642
Inventor 谢斌罗小兵周姝伶余兴建夏璞真
Owner HUAZHONG UNIV OF SCI & TECH
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