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Flexible circuit board and manufacturing method thereof

A technology of flexible circuit boards and manufacturing methods, which is applied in the direction of circuit substrate materials, printed circuit manufacturing, printed circuits, etc., can solve problems such as large elastic modulus, FPC cannot be applied, and the number of times of bending resistance cannot exceed 100,000 times. The effect of good pattern quality and high bending resistance

Pending Publication Date: 2021-05-28
INST OF FLEXIBLE ELECTRONICS TECH OF THU ZHEJIANG +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the traditional FPC is made of flexible copper clad laminate (Flexible Copper Clad Laminate, FCCL) through exposure, development and etching processes. Since the material of FCCL is mainly composed of polyimide and copper foil, while the material of polyimide and copper It does not have stretchability and has a large elastic modulus, so that the bending resistance of traditional FPC cannot exceed 100,000 times, making traditional FPC unable to be well applied in environments with high folding requirements, such as folding screen mobile phones , folding screen computer, etc.

Method used

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  • Flexible circuit board and manufacturing method thereof
  • Flexible circuit board and manufacturing method thereof
  • Flexible circuit board and manufacturing method thereof

Examples

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no. 1 example

[0042] figure 1 is a sectional view of the flexible circuit board shown according to the first embodiment. Such as figure 1 As shown, the flexible circuit board of this embodiment includes a dielectric elastic substrate 11 and a conductive pattern layer 12 , the dielectric elastic substrate 11 is corrugated, and the conductive pattern layer 12 is located on one side of the dielectric elastic substrate 11 .

[0043] The dielectric elastic substrate 11 is a dielectric material with suitable elasticity such as polydimethylsiloxane (PDMS), polyurethane (TPU), and the conductive pattern layer 12 is preferably copper. Optionally, the dielectric elastic substrate 11 The thickness is 25 μm˜1 mm, and the thickness of the conductive pattern layer 12 is 1 μm˜16 μm. The conductive pattern layer 12 is located on one side of the dielectric elastic substrate 11, and the dielectric elastic substrate 11 is wavy, so that the flexible circuit board as a whole is wavy, and the amplitude and per...

no. 2 example

[0052] image 3 It is a schematic flowchart of the manufacturing method of the flexible circuit board according to the second embodiment. Such as image 3 As shown, the manufacturing method of the flexible circuit board of this embodiment includes the following steps:

[0053] In step 210, the dielectric elastic substrate is pre-stretched and fixed to a rigid substrate.

[0054] Wherein, the dielectric elastic substrate is a dielectric material with suitable elasticity such as polydimethylsiloxane (PDMS) and polyurethane (TPU). Optionally, the thickness of the dielectric elastic substrate is 25 μm to 1 mm. The pre-stretching stretch rate of the elastic substrate depends on the stretch rate of the flexible circuit board to be designed, such as 20%, 30% and so on. After the dielectric elastic substrate is pre-stretched, the stretched two ends can be bent and wound to the back of the rigid substrate, and pasted and fixed by high-viscosity and high-temperature-resistant adhesiv...

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Abstract

The invention relates to a flexible circuit board and a manufacturing method thereof. The flexible circuit board comprises a dielectric elastic substrate and a conductive pattern layer, the dielectric elastic substrate is wavy, and the conductive pattern layer is located on one side surface of the dielectric elastic substrate. The manufacturing method of the flexible circuit board comprises the following steps of pre-stretching a dielectric elastic substrate and fixing the dielectric elastic substrate on a rigid substrate, forming a conductive pattern layer on the dielectric elastic substrate, releasing the dielectric elastic substrate to enable the dielectric elastic substrate to deform and restore to be wavy, and obtaining the flexible circuit board. According to the flexible circuit board, the dielectric elastic substrate is adopted and is wavy, so that the whole flexible circuit board can be stretched, and the number of times of bending resistance is high. In addition, the dielectric elastic substrate is pre-stretched and fixed on the rigid substrate to manufacture the conductive pattern layer, so that the dielectric elastic substrate can form a regular wavy structure, and the pattern quality of the conductive pattern is good.

Description

technical field [0001] The present application relates to the technical field of circuit boards, in particular to a flexible circuit board and a manufacturing method thereof. Background technique [0002] Flexible Printed Circuit (FPC) is a printed circuit board made of flexible insulating substrates (mainly polyimide or polyester film), which has many advantages that rigid printed circuit boards do not have, such as being able to Free to bend, coil, fold. Therefore, the use of FPC can greatly reduce the volume of electronic products and meet the needs of electronic products in the direction of high density, miniaturization and high reliability. However, the traditional FPC is made of flexible copper clad laminate (Flexible Copper Clad Laminate, FCCL) through exposure, development and etching processes. Since the material of FCCL is mainly composed of polyimide and copper foil, while the material of polyimide and copper It does not have stretchability and has a large elast...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/03H05K3/00H05K3/18
CPCH05K1/0393H05K3/0011H05K3/18H05K3/188
Inventor 冯雪王志建陈颖刘兰兰
Owner INST OF FLEXIBLE ELECTRONICS TECH OF THU ZHEJIANG
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