Preparation method and application of hot-pressed photonic polycrystalline semiconductor
A technology of polycrystalline semiconductors and photons, applied in phototherapy, crystal growth, polycrystalline material growth, etc., can solve the problem of inability to emit sustainable far-infrared rays, poor far-infrared emissivity and mechanical strength, and low yield of infrared optical materials To achieve the effect of promoting normal quantum vibration, improving immunity, and activating cell activity
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[0024] In order to solve the above technical problems, the first aspect of the present invention provides a method for preparing a hot-pressed photonic polycrystalline semiconductor, at least including the following steps:
[0025] (1) Mix the solid inorganic matter and the rare earth salt compound, and perform firing to obtain a fired mixture A, transfer the fired mixture A to a reaction kettle to react for a period of time, cool it, and then grind it to obtain a powder material B;
[0026] (2) Heating the carrier, adding the surface treatment agent and powder material B, and stirring, then feeding into an extruder for extrusion and granulation, and drying to obtain a hot-pressed photonic polycrystalline semiconductor.
[0027] In a preferred embodiment, the firing temperature in the step (1) is 1500-1700°C.
[0028] In a preferred embodiment, the temperature of the firing mixture A in the step (1) is 900-1000° C. during the reaction in the reactor.
[0029] In a preferred e...
Embodiment 1
[0049] A method for preparing a hot-pressed photonic polycrystalline semiconductor, the preparation method comprising the following steps:
[0050] (1) Mix 5 parts of zirconia, 5 parts of tin oxide, 4 parts of neodymium chloride, 6 parts of cerium acetate, 4 parts of scandium chloride, 3 parts of kaolinite, 1 part of black tourmaline and 1.2 parts of hydrotalcite, at 1500 ℃ in a high-temperature furnace to obtain a firing mixture A; transfer the firing mixture A to a reactor at a temperature of 950°C and a pressure of 15 MPa, and react in a high-temperature and high-pressure reactor for 35 hours. After cooling, grind to obtain a powder material B ;
[0051] (2) Heat 45 parts of linear low density polyethylene to 120°C, add 0.3 parts of γ-methacryloxypropyl trimethoxysilane and powder material B, mix and stir for 18 hours, and send them into the extruder for extrusion After granulation and drying, a hot-pressed photonic polycrystalline semiconductor can be obtained.
[0052] ...
Embodiment 2
[0054] A method for preparing a hot-pressed photonic polycrystalline semiconductor, the preparation method comprising the following steps:
[0055] (1) Mix 5 parts of zirconia, 5 parts of tin oxide, 4 parts of neodymium chloride, 6 parts of cerium acetate, 4 parts of scandium chloride, 3 parts of kaolinite, 1 part of black tourmaline and 1.2 parts of hydrotalcite, at 1600 ℃ in a high-temperature furnace to obtain a firing mixture A; transfer the firing mixture A to a reactor at a temperature of 950°C and a pressure of 15 MPa, and react in a high-temperature and high-pressure reactor for 35 hours. After cooling, grind to obtain a powder material B ;
[0056] (2) Heat 45 parts of linear low density polyethylene to 120°C, add 0.3 parts of γ-methacryloxypropyl trimethoxysilane and powder material B, mix and stir for 18 hours, and send them into the extruder for extrusion After granulation and drying, a hot-pressed photonic polycrystalline semiconductor can be obtained.
[0057] ...
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