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Flexible toughening composition, toughening type epoxy resin adhesive and preparation method of toughening type epoxy resin adhesive

A technology of epoxy resin glue and epoxy resin, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of complex synthesis method, high cost, adverse effects on other properties of materials, etc.

Pending Publication Date: 2021-04-27
NICHE TECH KAISER SHANTOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although these methods can effectively improve the toughness of epoxy resin, they will have adverse effects on other properties of the material.
Many elastomers and thermoplastic resin tougheners have poor compatibility with epoxy resins, it is difficult to mix evenly, and sometimes other solvents need to be introduced, and it will also affect the strength, modulus and heat resistance of the product, etc.
Although inorganic nanoparticles will not reduce the heat resistance of the material, it is difficult to disperse, and too much addition will cause the viscosity of the system to increase, and the toughening range is limited
In addition, the synthesis methods of some high-performance additives are complicated and costly, which also limits their popularization and application.

Method used

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  • Flexible toughening composition, toughening type epoxy resin adhesive and preparation method of toughening type epoxy resin adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] In this embodiment, the preparation method of the flexible and toughened composition comprises the following steps:

[0028] (1) Prepare the following raw materials in proportion by weight: 67 parts of epoxy resin A (both are bisphenol A type epoxy resin), 24 parts of curing agent A (both are methyl hexahydrophthalic anhydride), diol 8 parts (both are ethylene glycol), 0.5 parts of curing accelerator A (both are triphenylethylphosphonium bromide), 0.15 parts of coupling agent (both are γ-glycidyl etheroxypropyltrimethoxysilane) and 12 parts of inorganic nanoparticles (both alumina powder with a particle size of 20nm);

[0029] (2) Add the raw materials prepared in step (1) into a dry reaction container, stir until they are evenly mixed (stirring for 30 minutes) to obtain a mixed material; then put the mixed material in an oven for reaction, and the reaction condition is 120°C Pre-react at low temperature for 2 hours, and then react at 150° C. for 3 hours. After the rea...

Embodiment 2

[0035] In this embodiment, the preparation method of the flexible and toughened composition comprises the following steps:

[0036] (1) Prepare the following raw materials in proportion by weight: 59 parts of epoxy resin A (including 41 parts of bisphenol A epoxy resin, 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexyl carboxylate 18 parts), 30 parts of curing agent A (15 parts of methyl hexahydrophthalic anhydride and 15 parts of methyl tetrahydrophthalic anhydride), 8 parts of diol (both are 1,4 butanediol), curing 0.4 parts of accelerator A (both tetrabutylammonium bromide), 0.2 parts of coupling agent (both 3-aminopropyltriethoxysilane) and 15 parts of inorganic nanoparticles (both are carbon dioxide with a particle size of 50nm silica fume);

[0037] (2) Add the raw materials prepared in step (1) into a dry reaction container, stir until evenly mixed (stirring for 20 minutes), and obtain a mixed material; then put the mixed material in an oven for reaction, and the reaction ...

Embodiment 3

[0043] In this embodiment, the preparation method of the flexible and toughened composition comprises the following steps:

[0044] (1) Prepare the following raw materials in proportion by weight: 56 parts of epoxy resin A (including 28 parts of bisphenol A type epoxy resin and 28 parts of bisphenol S type epoxy resin), 31 parts of curing agent A (of which methyl tetrahydro 20 parts of phthalic anhydride, 11 parts of methyl nadic anhydride), 12 parts of diols (both are 1,3 propylene glycol), 0.6 parts of curing accelerator A (both are triphenylethylphosphonium bromide), 0.25 parts of joint agent (both γ-methacryloxypropyltrimethoxysilane) and 18 parts of inorganic nanoparticles (including 9 parts of alumina powder with a particle size of 20nm and zinc oxide powder with a particle size of 50nm);

[0045] (2) Add the raw materials prepared in step (1) into a dry reaction container, stir until they are evenly mixed (stirring for 20 minutes) to obtain a mixed material; then put th...

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Abstract

The invention provides a flexible toughening composition. The flexible toughening composition comprises the following components in parts by weight: 50-70 parts of epoxy resin A, 20-35 parts of a curing agent A, 5-15 parts of dihydric alcohol, 0.2-0.8 part of a curing accelerator A, 0.1-0.5 part of a coupling agent and 10-20 parts of inorganic nanoparticles, the toughening type epoxy resin adhesive is prepared from the following components in parts by weight: 5-20 parts of the flexible toughening composition, 35-58 parts of epoxy resin B, 25-45 parts of a curing agent B and 0.2-0.6 part of a curing accelerator B. The invention also provides preparation methods of the flexible toughening composition and the toughening type epoxy resin adhesive. The flexible toughening composition provided by the invention has no obvious adverse effect on the high temperature resistance of the material and the bonding performance of the metal substrate while obviously improving the toughness of the epoxy resin adhesive.

Description

technical field [0001] The invention relates to the field of epoxy resin materials, in particular to a flexible and toughening composition, a toughening epoxy resin adhesive and a preparation method thereof. Background technique [0002] Epoxy resin has high modulus, good mechanical strength, chemical corrosion resistance, excellent electrical insulation performance, and excellent adhesion to various materials. It has been widely used in adhesives, electronics, civil engineering, aerospace, Transportation and other industrial fields. However, due to the high cross-linking density and large internal stress after curing, the simple epoxy resin has a brittle texture, poor impact toughness, fatigue resistance, and thermal shock resistance, which limits its application in many aspects. Therefore, the toughening modification of epoxy resin materials has always been a hot topic of concern and research. [0003] At present, epoxy resin toughening methods emerge in endlessly, mainl...

Claims

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Application Information

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IPC IPC(8): C09J163/02C09J11/04C09J11/08
CPCC09J163/00C09J11/04C09J11/08C08L2205/025C08K2003/2227C08K2201/011C08K2003/2296C08L63/00C08K3/22C08K3/36
Inventor 周博轩胡松冯兆丰许喜銮宋伟佳
Owner NICHE TECH KAISER SHANTOU
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