Antistatic adhesive tape and preparation method thereof

Abstract

The invention discloses an antistatic adhesive tape and a preparation method thereof. The antistatic adhesive tape comprises a base material, a curing bonding layer coated on the base material and a release film coated on the curing bonding layer; the curing bonding layer is prepared from the following raw materials by weight: an ethyl silicate coating, epoxy resin, organic silicon rubber, bonding resin, a photoinitiator, a curing cross-linking agent, an antistatic adhesive, a toughening agent, a polyester emulsion and a platinum catalyst emulsion; the antistatic adhesive comprises the following raw materials by weight: an acrylic resin pressure-sensitive adhesive, silver-nickel-zinc powder, a dispersing agent, an antistatic agent and an organic solvent. Through reasonable formula design, the prepared adhesive tape integrates excellent antistatic performance and conductive performance, has the advantage of good bonding performance, has good antistatic performance and thermal stability, can be kept unchanged for several years at room temperature or higher temperature, is not influenced by environmental humidity, the anti-static effect can be normally achieved at high temperature, curing is fast, and safety and reliability are achieved.

Description

technical field [0001] The invention relates to the technical field of adhesive tape production, in particular to an antistatic adhesive tape and a preparation method thereof. Background technique [0002] With the rapid development of electronic science and technology, the application of adhesive tape in the field of electronic industry has also developed by leaps and bounds. However, due to the limitations of traditional adhesive tape processing methods, various adhesive tapes have a certain amount of static electricity to varying degrees, which makes the surface of the substrate adsorbed. dust or other particles, thereby affecting the service life of related electronic devices. Simultaneously because adhesive tape is a kind of chemical synthesis material, the processing method of prior art is mainly devoted to the improvement to the function of adhesive tape, and the environmental protection problem of adhesive tape is often ignored by people. [0003] But at present, th...

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Problems solved by technology

[0002] With the rapid development of electronic science and technology, the application of adhesive tape in the field of electronic industry has also developed by leaps and bounds. However, due to the limitations of traditional adhesive tape processing methods, various adhesive tapes have a certain amount of static electricity to varying degrees, which makes the surface of the substrate adsorbed. Dust or other particles, thereby affecting the service life of related electronic devices

Simultaneously because adhesive tape is a kind of chemical synthesis material, the processing method of prior art is mainly devoted to the improvement to the function of adhesive tape, and the environmental protection problem of adhesive tape is often ignored by people.

[0003] But at present, the application of tapes in these industries has the following problems: due to the inherent physical and chemical properties of the tape itself, various tapes have a certain amount of static electricity to varying degrees, so that dust or other particles are adsorbed on the surface of the substrate, which affects the relevant Lifespan of Electronic Devices