A kind of water-soluble lead-free solder paste, water-washing solder paste and preparation method thereof

A soldering paste, water-soluble technology, applied in the field of water-washing ultrafine tin powder water-soluble lead-free high-temperature soldering paste and its preparation, can solve the problem that cannot meet the finer operation requirements, the soldering paste has strong aggressiveness to tin powder, Affect the reliability of welding effect and other issues, and achieve the effect of improving water washability, good cleanability, and good stability of solder paste

Active Publication Date: 2022-05-27
深圳市晨日科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Ultra-fine-pitch semiconductors (4-6mil) require tin powder of size below No. 6 (5-15 microns). At present, traditional water-washed solder paste generally has poor oxidation resistance, which leads to easy oxidation of tin powder, which affects soldering effect and storage reliability.
[0009] (2) Insufficient welding ability
[0010] Ordinary water-washed solder paste lacks rosin carrier, and the solder paste is highly aggressive to tin powder, so the active body configuration is weaker than conventional solder paste. For the welding of special semiconductor materials, the soldering ability is insufficient
[0011] (3) The thixotropic index is low
[0012] The thixotropic index of conventional water-washed solder paste is about 0.5-0.6, which is not up to the expected thixotropic index of 0.6-0.7, so it cannot meet the more refined operation requirements

Method used

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  • A kind of water-soluble lead-free solder paste, water-washing solder paste and preparation method thereof
  • A kind of water-soluble lead-free solder paste, water-washing solder paste and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] The water-soluble lead-free solder paste consists of the following components in parts by weight:

[0055] 51 parts of antioxidant, 16.8 parts of organic solvent, 4 parts of thixotropic agent, 12 parts of active agent, 8.2 parts of corrosion inhibitor, and 8 parts of surfactant.

[0056] Among them, the antioxidant is composed of water-soluble polymerized rosin, high acid value liquid organic acid EB9, tetrahydroxypropyl ethylenediamine, polyoxyethylene tallow amine in a weight ratio of 2:4.8:2.4:1; the organic solvent is composed of Tetraethylene glycol dimethyl ether and 1-decanol are mixed in a weight ratio of 1:2; the thixotropic agent is a water-soluble polyamide, and the active agent is malonic acid, dihydroxymethyl propionic acid, succinic acid and cyclic Hexylamine adipate is composed by weight ratio of 1:12:5:6; corrosion inhibitor is composed of diethylimidazole and triethanolamine by weight ratio of 1.56:1.

[0057] The water-soluble polyamide is a water-sol...

Embodiment 2

[0068] The water-soluble lead-free solder paste consists of the following components in parts by weight:

[0069] 51 parts of antioxidant, 16.8 parts of organic solvent, 6 parts of thixotropic agent, 12 parts of active agent, 8.2 parts of corrosion inhibitor and 8 parts of surfactant.

[0070] Among them, the antioxidant is compounded by water-soluble polymerized rosin, high acid value liquid organic acid EB9, tetrahydroxypropyl ethylenediamine, and polyoxyethylene tallow amine in a weight ratio of 3:5:3:1; the organic solvent is composed of Tetraethylene glycol dimethyl ether and 1-decanol are mixed in a weight ratio of 1:3; the thixotropic agent is composed of water-soluble polyamide and water-based vinyl ether in a weight ratio of 4:2, and the active agent is composed of propylene glycol Acid, dihydroxymethyl propionic acid, succinic acid and cyclohexylamine adipate in a weight ratio of 1:15:7:8; corrosion inhibitor is composed of diethylimidazole and triethanolamine in a w...

Embodiment 3

[0083] The water-soluble lead-free solder paste consists of the following components in parts by weight:

[0084] 51 parts of antioxidant, 16.8 parts of organic solvent, 8 parts of thixotropic agent, 12 parts of active agent, 8.2 parts of corrosion inhibitor and 8 parts of surfactant.

[0085] Among them, the antioxidant is made up of water-soluble polymerized rosin, high acid value liquid organic acid EB9, tetrahydroxypropyl ethylenediamine, and polyoxyethylene tallow amine in a weight ratio of 1:3:2:1; the organic solvent is composed of Tetraethylene glycol dimethyl ether and 1-decanol are mixed in a weight ratio of 1:1; the thixotropic agent is composed of water-soluble polyamide and water-based vinyl ether in a weight ratio of 6:2, and the active agent is composed of propylene glycol Acid, dihydroxymethyl propionic acid, succinic acid and cyclohexylamine adipate in a weight ratio of 1:10:3:4; corrosion inhibitor is composed of diethylimidazole and triethanolamine in a weig...

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Abstract

The invention discloses a water-washable superfine tin powder water-soluble lead-free high-temperature soldering paste and a preparation method thereof, comprising the following raw materials in parts by weight: 30-55 parts of antioxidant, 10-26 parts of organic solvent, and 4-4 thixotropic agent 8 parts, 8-16 parts of active agent, 6-10 parts of corrosion inhibitor and 6-10 parts of surfactant. The water-washed solder paste prepared by using the solder flux paste of the invention has good stability and effectively meets practical requirements such as oxidation resistance, fullness of tin dots, low voids, no residue splashing, and good cleaning performance.

Description

technical field [0001] The invention belongs to the technical field of flux paste, and in particular relates to a water-soluble lead-free high-temperature flux paste of water-washed ultrafine tin powder and a preparation method thereof. Background technique [0002] With the development of the semiconductor packaging industry, the semiconductor packaging methods have become more sophisticated, and the use of no-clean solder paste welding cannot meet the requirements of more and more precise and smaller pitch welding. Residues in the no-clean solder paste for ultra-fine pitch welding, especially chip welding of semiconductor device packaging, can easily cause chip breakdown and short circuit, drop in withstand voltage, leakage and many other adverse effects under the condition of large instantaneous current. . This requires that the residue must be completely removed after soldering, so the current ordinary rosin type no-clean solder paste cannot meet the cleaning requiremen...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/362B23K35/36
CPCB23K35/362B23K35/3612
Inventor 吴高健钱雪行
Owner 深圳市晨日科技股份有限公司
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