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A kind of silicon-based tray for mocvd equipment and preparation method

A tray and silicon-based technology, applied in metal material coating process, coating, gaseous chemical plating, etc., can solve problems such as cracking and falling off of SiC coating, easy oxidation of graphite material, etc., to relieve thermal expansion and reduce peak stress Effect

Active Publication Date: 2022-08-02
湖南德智新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Graphite has excellent characteristics such as high temperature resistance, high thermal conductivity, and high temperature strength. It is the first choice material for epitaxial single crystal substrate pedestal substrates, but graphite materials are easy to oxidize, corrode, and have poor wear resistance, and graphite powder is easy to produce , it is easy to release adsorbed gas under vacuum, pollute the process growth environment, and greatly reduce the quality of the semiconductor film, so it cannot be directly used to grow semiconductors, and a uniform and dense SiC ceramic coating must be coated on the surface of the graphite base plate
However, due to the large thermal expansion difference between the thermal expansion coefficient of the SiC coating and the graphite substrate, the SiC coating cracks or even falls off, and the graphite substrate lacking coating protection will corrode rapidly, resulting in failure and scrapping, resulting in economic losses and production. cost increase

Method used

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  • A kind of silicon-based tray for mocvd equipment and preparation method

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preparation example Construction

[0032] A method for preparing a silicon-based tray for MOCVD equipment according to a specific embodiment of the present invention includes the following steps:

[0033] (1) Deposit a pyrolytic carbon transition layer on the surface of the Si substrate by chemical vapor deposition. Preferably, the deposition conditions of the pyrolytic carbon layer are as follows: methane is used as the carbon source material, argon is used as the diluent gas, and the deposition temperature is 900-1200 ℃, deposition time: 1~20h;

[0034] (2) The temperature is then increased to 1200-1400° C. and kept for 1-2 hours to form a SiC interface layer;

[0035] (3) The temperature is then lowered to 1000-1300°C, and a SiC coating is deposited on the prepared pyrolytic carbon transition layer by chemical vapor deposition. Preferably, the deposition conditions of the SiC coating are as follows: methyltrichlorosilane is used as SiC The source material is argon as the diluent gas, hydrogen as the carrier...

Embodiment 1

[0037] The silicon-based tray for MOCVD equipment in this embodiment is composed of a Si substrate 1, a pyrolytic carbon transition layer 2, a SiC coating 3, and a SiC interface layer 4 at the interface between the Si substrate 1 and the pyrolytic carbon layer 2, The base material of the tray is high-purity Si material, its purity is 99.9999%, the diameter is 120mm, there are 3 circular grooves on the surface, the groove depth is 1mm, there is a composite coating on the surface of the tray, and the innermost layer is a pyrolytic carbon transition layer 2, There is a layer of SiC interface layer 4 between the pyrolytic carbon transition layer 2 and the Si substrate 1 , and the outermost layer is a SiC coating layer 3 . The thickness of the tray is 3 mm, the thickness of the outermost SiC coating layer 3 is 100 μm, the thickness of the pyrolytic carbon transition layer 2 is 5 μm, and the thickness of the SiC interface layer 4 is 100 nm.

[0038] The preparation method of the sil...

Embodiment 2

[0043] The silicon-based tray for MOCVD equipment in this embodiment is composed of a Si substrate 1, a pyrolytic carbon transition layer 2, a SiC coating 3, and a SiC interface layer 4 at the interface between the Si substrate 1 and the pyrolytic carbon layer 2, The base material of the tray is high-purity Si material, its purity is 99.9999%, the diameter is 120mm, there are 3 circular grooves on the surface, the groove depth is 1mm, there is a composite coating on the surface of the tray, and the innermost layer is a pyrolytic carbon transition layer 2, There is a layer of SiC interface layer 4 between the pyrolytic carbon transition layer 2 and the Si substrate 1 , and the outermost layer is a SiC coating layer 3 . The thickness of the tray is 3 mm, the thickness of the outermost SiC coating layer 3 is 90 μm, the thickness of the pyrolytic carbon transition layer 2 is 6 μm, and the thickness of the SiC interface layer 4 is 80 nm.

[0044] The preparation method of the silic...

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Abstract

The invention discloses a silicon-based tray for MOCVD equipment and a preparation method, which comprises a Si matrix constituting a base material of the tray and a composite coating on the surface of the Si matrix, the composite coating comprising a pyrolytic carbon transition layer, a Si matrix The SiC interface layer at the interface with the pyrolytic carbon transition layer, and the outermost SiC coating, the SiC interface layer is formed by the reaction between the pyrolytic carbon transition layer and the Si matrix at the interface. At high temperature, the pyrolytic carbon layer can form a dense silicon carbide interface layer with the silicon substrate through chemical bonds and strong bonding at the interface, which further protects the pallet substrate. At the same time, the pyrolytic carbon layer can match the difference in thermal expansion coefficient between the substrate and the outermost layer. The soft C-layer structure in the composite coating can effectively relieve the thermal expansion of the outermost SiC crystal to reduce the stress peak in the coating.

Description

technical field [0001] The invention belongs to the field of semiconductors, and in particular relates to a silicon-based tray for MOCVD equipment and a preparation method. Background technique [0002] Graphite susceptor trays (ie trays) for semiconductors are key consumables for epitaxial growth of single crystal InP, GaN, and AlN semiconductors for MOCVD (Metal Organic Chemical Vapor Deposition) equipment, and play an irreplaceable role in the semiconductor chip industry chain. Graphite has excellent properties of high temperature resistance, high thermal conductivity, high temperature strength, etc. It is the preferred material for the base plate of epitaxial single crystal substrate, but graphite material is easy to oxidize, easy to corrode, and has poor wear resistance, and it is easy to produce graphite powder. , it is easy to release adsorbed gas under vacuum, pollute the process growth environment, and greatly reduce the quality of semiconductor films, so it cannot ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C16/458
CPCC23C16/4581C23C16/4583
Inventor 汪洋余盛杰刘佳宝柴攀万强
Owner 湖南德智新材料有限公司
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