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Multi-functional electrically and thermally conductive adhesive tape

A technology of electrical and thermal conductivity, conductive tape, applied in the direction of adhesive, conductive adhesive connection, chemical instruments and methods, etc., can solve the problems of low thermal conductivity and insulation, and achieve high precision and precision, simple process, low manufacturing cost. Effect

Inactive Publication Date: 2003-10-08
FOUR PILLARS ENTERPRISES +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the adhesive material of the conductive or thermally conductive substance in this prior art product is usually a polymer layer, such as a silica gel layer, and this type of polymer material (polymers) has a continuous structural phase and thermal stability in use, but due to its own Most of the material properties are low thermal conductivity and insulation properties. After blending with conductive and thermal conductive powder media, its overall electrical or thermal conductivity is much worse than that of pure metal materials.

Method used

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  • Multi-functional electrically and thermally conductive adhesive tape
  • Multi-functional electrically and thermally conductive adhesive tape
  • Multi-functional electrically and thermally conductive adhesive tape

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 2

[0046] Figure 4A to Figure 4C It shows a sectional view of the manufacturing process of the conductive and thermally conductive adhesive tape according to the second embodiment of the present invention.

[0047] Please refer to Figure 4A , provide a substrate 300, this substrate can be a plastic film, such as polypropylene (PP), polyethylene terephthalate (PET), polyethylene (PE), polyethylene glycol terephthalate (PEN), polyimide film (PI), polyvinyl chloride (PVC) film or other materials. Then, a metal layer 301 is compounded to cover a surface of the substrate 300 to form a composite film structure. Wherein, the material of the metal layer 301 can be a metal vapor-deposited film such as vapor-deposited aluminum film or a laminated or thermocompressed metal foil. The metal foil can be copper foil, aluminum foil, single-sided or double-sided electroplated silver-copper alloy , silver-plated, tin-lead-plated, chrome-plated, nickel-plated, gold-plated copper foil, etc. or ...

Embodiment 3

[0052] Please refer to Fig. 6, with the substrate 200 using the metal layer in the first embodiment, it is recommended to use tin-plated copper foil, and coat an adhesive layer 204 on one side, and the selection of the material for the adhesive layer 204 is based on the best product quality. The application is mainly based on pure rubber, conductive glue or thermal conductive glue. It is recommended to use pure glue, and the pure glue can be any glue, such as polypropylene glue, silica gel, rubber, hot melt glue, epoxy resin etc. In practice, a release layer 205 is pasted on the other side of the adhesive layer 204, and the release layer 205 can be a release paper or a release film. Then, the rolling action is carried out, such as using diamond wheels, diamond platform rolling machines, pointed wheels or other rolling machines for rolling. When rolling, the rolling direction is from the substrate side to the The direction of the adhesive layer is rolled, and when rolling, a p...

Embodiment 4

[0058] Using a metal substrate 200 similar to that in Embodiment 1, it is recommended to use a composite metal foil of tin and copper or tin-lead and copper, and coat an adhesive layer 204 on one side. The selection of the adhesive layer material is based on the best product. The application occasions are mainly pure glue, conductive glue or heat conduction glue. The pure glue system can be any glue system, such as polypropylene glue, silica gel, rubber, hot melt glue, epoxy resin and the like. After that, in practice, a release layer 205 is pasted on the other side of the adhesive layer 204, and the release layer 205 can be a release paper or a release film. Then, the rolling action is carried out, such as using a diamond wheel, a diamond platform rolling machine, a pointed wheel or other rolling machines for rolling. When rolling, the rolling direction is from the substrate side to the The direction of the adhesive layer is rolled, and when rolling, the metal substrate 200 ...

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Abstract

A multi-functional electrically and thermally conductive adhesive tape is described. The adhesive tape at least has the following structures: a complex structure or a single structure having a plurality of protuberant holes or concavities extended from one side of the complex structure or the single structure. Adhesive material is coated on both sides or a single side of the complex structure or the single structure, wherein the adhesive layer is an electrically and thermally conductive layer or an electrically non-conductive layer. The electrically non-conductive adhesive layer, depending on the practical application, can be chosen from any kind of adhesive material. The electrically conductive adhesive layer can be chosen from any kind of adhesive material doped with electrically and thermally conductive dopants.

Description

technical field [0001] The invention relates to a structure of an adhesive tape and a manufacturing method thereof, in particular to a structure and a manufacturing method of an adhesive tape with excellent electrical or thermal conductivity. Background technique [0002] As the size of electronic devices becomes smaller and smaller, the demand for the density and precision of their circuits will also become higher and higher, and the components or equipment will be subject to electromagnetic wave interference, static electricity damage, and electrical appliances. It is more important to solve the problems of compatibility and the like. The conductive and thermally conductive adhesive tape of the present invention has both adhesiveness and superior electrical and thermal conductivity characteristics and electromagnetic protection function characteristics. The tape has greater convenience and advancement than traditional connectors that use lock screws, rivets or welding to c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B7/02B32B3/26B32B7/12C09J7/28C09J9/00C09J133/00C09J163/00H01R4/04
CPCC09J7/0292C09J2201/162C09J7/0264C09J7/0246C09J7/0296B32B7/12B32B3/26C09J2400/163C09J2201/28C09J7/38C09J7/22C09J7/28C09J7/29C09J2301/162C09J2301/204
Inventor 林启祥
Owner FOUR PILLARS ENTERPRISES
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