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A kind of preparation method of LED heat dissipation fin with large heat dissipation area

A heat dissipation fin and heat dissipation area technology, which is applied in lighting and heating equipment, semiconductor devices of light-emitting elements, cooling/heating devices of lighting devices, etc., can solve the problems of low corrosion resistance, increased volume and weight, and achieve expansion Surface area, heat dissipation performance does not decay for a long time, and the effect of high productivity

Active Publication Date: 2022-03-08
哈尔滨鑫科纳米科技发展有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0009] In order to solve the existing problems of increasing the heat dissipation area of ​​LED heat dissipation fins, which often bring about increased volume and weight, and the low corrosion resistance of the currently used large-area AI-Mg alloy heat dissipation fins, the present invention provides a The preparation method of the new large heat dissipation area LED heat dissipation fin comprises the following steps:

Method used

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  • A kind of preparation method of LED heat dissipation fin with large heat dissipation area
  • A kind of preparation method of LED heat dissipation fin with large heat dissipation area
  • A kind of preparation method of LED heat dissipation fin with large heat dissipation area

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preparation example 1

[0072] The preparation of preparation example 1 titanium nano polymer colloid:

[0073] 100g of pure titanium powder with a metal content greater than 99.5%, a pulverizer (low molecular weight epoxy resin E51) with 5%wt of titanium powder mass, an auxiliary pulverizer (oleic acid) with 5%wt of titanium powder mass and 0.5% dispersant (byk170) are added together in 100g colloidal carrier (xylene), 300rpm high stirs and mixes evenly, takes this mixture and joins in the feed tank of pulverizer, carries out 3h grinding, after grinding, naturally cools to room temperature, filters afterwards, obtains fineness It is a titanium nanometer primary polymer below 50~75nm; then, add titanium powder quality 0.1%wt anti-flocculation agent (naphthalene sulfonate formaldehyde condensate) and titanium powder quality 0.2%wt antiflocculant in titanium nanometer primary polymer; The precipitating agent (stearic acid) and the anti-precipitation agent (BYK410) with 2.5% titanium powder mass are sub...

preparation example 2

[0084] The preparation of preparation example 2 graphene colloids:

[0085] The composition (in parts by mass) of graphene colloid is: 5 parts of graphene, 0.1 part of wetting and dispersing agent, 10 parts of crosslinking agent, 0.3 part of anti-flocculation agent, 0.5 part of anti-sedimentation agent, 100 parts of colloid carrier; 5 parts of graphene, 0.1 part of wetting and dispersing agent (wetting and dispersing agent S596), 10 parts of crosslinking agent (2,5-dimethyl-2,5-di-tert-butylperoxyhexane), colloid carrier (cyclo Oxygen resin F51) 100 parts, 300rpm high stirring mixes, packs in graphene polymer preparation special equipment feed tank (disclosed in patent CN201821944605.6), grinds 2h, obtains graphene colloid primary polymer; Add 0.3 part of anti-flocculation agent (Efka LP-9009) and 0.5 part of anti-sedimentation agent (Deqian 202P) to the polymer, and grind for 1 hour with a high-energy grinder to obtain graphene colloid.

preparation example 3

[0086] Preparation Example 3 Preparation of a rare metal heat dissipation and anti-corrosion coating for LED heat dissipation fins: according to the following formula (in parts by mass):

[0087]

[0088] (1) Component A: Add 33 parts of the above two resins, titanium nanopolymer colloid, graphene colloid, silicon carbide, BYK301, BYK410 and mixed solvent into the paint bucket, start stirring, and mix evenly; The density is 30μm, packed in drums;

[0089] (2) Component B: Take T31 and add 12 parts of mixed solvent, stir well.

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Abstract

The invention provides a method for preparing LED heat dissipation fins with large heat dissipation area, aiming at solving the problems of volume and weight increase caused by the existing method of increasing heat dissipation area of ​​LED heat dissipation fins, comprising the following steps: carrying out LED heat dissipation fins Deburring, chemical degreasing, water washing, drying, and partial sealing; the treated LED cooling fins are electrochemically treated in the electrolyte. The LED heat dissipation fins prepared by the method provided by the invention can increase the heat dissipation area by more than five times compared with the original area without increasing the weight of the fins, thereby effectively improving the heat dissipation effect.

Description

technical field [0001] The invention relates to LED lamp heat dissipation technology, in particular to a preparation method of LED heat dissipation fins with large heat dissipation area. [0002] It mainly involves the increase and protection of the heat dissipation area of ​​the heat dissipation fins of LED lamps, improving its heat dissipation capacity, and at the same time endowing the new heat dissipation surface with anti-corrosion and anti-fouling functions, keeping its heat dissipation performance from decaying for a long time, thereby prolonging the service life of LEDs. Background technique [0003] As a modern advanced energy-saving light source, LED lights are developing rapidly and are a major scientific and technological project in our country. The junction temperature determines the life of an LED lamp. For example, the life of a high-power white LED when the junction temperature is attenuated by 70% is as follows: [0004] Junction temperature °C 25...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21V29/503F21V29/74C09D163/00C09D5/10C09D7/61C09D7/63F21Y115/10
CPCF21V29/503F21V29/74C09D163/00C09D5/10C09D7/61C09D7/63F21Y2115/10C08K2003/385C08L2205/025C08L63/00C08K13/02C08K3/08C08K3/042C08K5/14C08K5/09C08K3/34C08K3/38
Inventor 薛俊峰朱兰芬
Owner 哈尔滨鑫科纳米科技发展有限公司
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